I. Introduction
Multi-level converter is widely adopted in converter design when the required voltage is higher than the single device blocking voltage. Diode-clamped converter and flying capacitor (FC) converter are two typical multi-level converter structures. However, with Si device, FC converter receives limited interest compared to the diode-clamped converter in the industrial product design. That is mainly because the low switching frequency of Si device requires a large FC to limit the voltage ripple. In recent years, SiC and GaN devices receive increasing attention because of their benefit in high-efficiency high power density converter design. [1]–[6] With the new SiC and GaN devices, FC converter receives increasing attention recently because the high switching frequency can significantly reduce the volume and value of the flying capacitor. In the literature, a few FC converters [7]–[8] have been demonstrated for low-voltage applications .