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A 33.5–37.5-GHz Four-Element Phased-Array Transceiver Front-End With Hybrid Architecture Phase Shifters and Gain Controllers | IEEE Journals & Magazine | IEEE Xplore

A 33.5–37.5-GHz Four-Element Phased-Array Transceiver Front-End With Hybrid Architecture Phase Shifters and Gain Controllers


Abstract:

To satisfy the requirements for a high output power of the transmitter (TX) and high-quality beamforming with a wide range, fine resolution, high accuracy, and good ortho...Show More

Abstract:

To satisfy the requirements for a high output power of the transmitter (TX) and high-quality beamforming with a wide range, fine resolution, high accuracy, and good orthogonality, in this work, we present a 33.5–37.5-GHz four-element phased-array transceiver front-end with two-way power combining power amplifiers (PAs), high-linearity low-loss stacked T/R switches, hybrid architecture phase shifters, and hybrid architecture gain controllers in a 65 nm CMOS process. The hybrid architecture phase shifter combines a reflection-type phase shifter (RTPS) with a 0°/180° phase switch. The RTPS provides a 180° phase shift (PS) range, and the 0°/180° phase switch expands the 0°–180° PS states into a full 360°. The hybrid architecture gain controller combines a 4-bit digital-step single-pole-double-throw (SPDT)-only attenuator with a two-stage 3-bit cascode variable gain amplifier (VGA). The attenuator generates large attenuation states for coarse-tuning, and the VGA generates small gain states for fine-tuning. The proposed phased-array transceiver front-end achieves a P_{\mathrm {sat}} of 19.8 dBm and an OP _{\mathrm {1\,dB}} of 17.2 dBm per element, a 6-bit full 360° PS range with an rms phase error lower than 2° and a gain variation lower than ±2 dB, and a 6-bit 0–31.5 dB gain control range with an rms gain error lower than 0.16 dB and a phase variation lower than ±3°.
Published in: IEEE Transactions on Microwave Theory and Techniques ( Volume: 71, Issue: 9, September 2023)
Page(s): 4129 - 4143
Date of Publication: 03 March 2023

ISSN Information:

Funding Agency:

Author image of Pingda Guan
School of Integrated Circuits, Tsinghua University, Beijing, China
Pingda Guan received the B.S. degree from Tsinghua University, Beijing, China, in 2017, where he is currently pursuing the Ph.D. degree at the School of Integrated Circuits.
His current research interests are in the field of millimeter-wave (mm-wave) circuits and systems, including power amplifiers (PAs), voltage-controlled oscillators (VCOs), phased arrays, and wireless transceivers.
Pingda Guan received the B.S. degree from Tsinghua University, Beijing, China, in 2017, where he is currently pursuing the Ph.D. degree at the School of Integrated Circuits.
His current research interests are in the field of millimeter-wave (mm-wave) circuits and systems, including power amplifiers (PAs), voltage-controlled oscillators (VCOs), phased arrays, and wireless transceivers.View more
Author image of Haikun Jia
School of Integrated Circuits, Tsinghua University, Beijing, China
Haikun Jia (Member, IEEE) received the B.S. and Ph.D. degrees in electronics engineering from Tsinghua University, Beijing, China, in 2009 and 2015, respectively.
He is currently an Assistant Professor with the School of Integrated Circuits, Tsinghua University. His research interests are in the field of millimeter-wave and high-speed circuit and system design, including power amplifiers (PAs), voltage-controlled oscillato...Show More
Haikun Jia (Member, IEEE) received the B.S. and Ph.D. degrees in electronics engineering from Tsinghua University, Beijing, China, in 2009 and 2015, respectively.
He is currently an Assistant Professor with the School of Integrated Circuits, Tsinghua University. His research interests are in the field of millimeter-wave and high-speed circuit and system design, including power amplifiers (PAs), voltage-controlled oscillato...View more
Author image of Wei Deng
School of Integrated Circuits, Tsinghua University, Beijing, China
Wei Deng (Senior Member, IEEE) received the B.S. and M.S. degrees from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2006 and 2009, respectively, and the Ph.D. degree from the Tokyo Institute of Technology, Tokyo, Japan, in 2013, all in electronic engineering.
From 2013 to 2014, he was a Post-Doctoral Researcher with the Tokyo Institute of Technology. From 2015 to 2019, he was wit...Show More
Wei Deng (Senior Member, IEEE) received the B.S. and M.S. degrees from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2006 and 2009, respectively, and the Ph.D. degree from the Tokyo Institute of Technology, Tokyo, Japan, in 2013, all in electronic engineering.
From 2013 to 2014, he was a Post-Doctoral Researcher with the Tokyo Institute of Technology. From 2015 to 2019, he was wit...View more
Author image of Shengnan Dong
School of Integrated Circuits, Tsinghua University, Beijing, China
Shengnan Dong received the B.S. degree in microelectronics science and engineering from Xi’an Jiaotong University, Xi’an, China, in 2018, and the M.S. degree in integrated circuit engineering from Tsinghua University, Beijing, China, in 2021.
Her current research interests include millimeter-wave (mm-wave) circuits, phased array circuits and systems, and wireless transceiver design.
Shengnan Dong received the B.S. degree in microelectronics science and engineering from Xi’an Jiaotong University, Xi’an, China, in 2018, and the M.S. degree in integrated circuit engineering from Tsinghua University, Beijing, China, in 2021.
Her current research interests include millimeter-wave (mm-wave) circuits, phased array circuits and systems, and wireless transceiver design.View more
Author image of Xiangrong Huang
School of Integrated Circuits, Tsinghua University, Beijing, China
Xiangrong Huang (Graduate Student Member, IEEE) received the B.S. degree from the College of Astronautics, Harbin Institute of Technology, Harbin, China, in 2018. He is currently pursuing the Ph.D. degree at the Institute of Microelectronics, Tsinghua University, Beijing, China.
His research interests focus on millimeter-wave (mm-wave) circuits, frequency-modulated continuous-wave (FMCW) radar, phased array circuits and sy...Show More
Xiangrong Huang (Graduate Student Member, IEEE) received the B.S. degree from the College of Astronautics, Harbin Institute of Technology, Harbin, China, in 2018. He is currently pursuing the Ph.D. degree at the Institute of Microelectronics, Tsinghua University, Beijing, China.
His research interests focus on millimeter-wave (mm-wave) circuits, frequency-modulated continuous-wave (FMCW) radar, phased array circuits and sy...View more
Author image of Zhihua Wang
School of Integrated Circuits, Tsinghua University, Beijing, China
Zhihua Wang (Fellow, IEEE) received the B.S., M.S., and Ph.D. degrees in electronic engineering from Tsinghua University, Beijing, China, in 1983, 1985, and 1990, respectively.
Since 1997, he has been a Full Professor with Tsinghua University. Since 2000, he has been the Deputy Director with the Institute of Microelectronics, Tsinghua University. From 1992 to 1993, he was a Visiting Scholar at Carnegie Mellon University, P...Show More
Zhihua Wang (Fellow, IEEE) received the B.S., M.S., and Ph.D. degrees in electronic engineering from Tsinghua University, Beijing, China, in 1983, 1985, and 1990, respectively.
Since 1997, he has been a Full Professor with Tsinghua University. Since 2000, he has been the Deputy Director with the Institute of Microelectronics, Tsinghua University. From 1992 to 1993, he was a Visiting Scholar at Carnegie Mellon University, P...View more
Author image of Baoyong Chi
School of Integrated Circuits, Tsinghua University, Beijing, China
Baoyong Chi (Senior Member, IEEE) received the B.S. degree in microelectronics from Peking University, Beijing, China, in 1998, and the Ph.D. degree from Tsinghua University, Beijing, in 2003.
From 2006 to 2007, he was a Visiting Assistant Professor with Stanford University, Stanford, CA, USA. He is currently a Full Professor and the Deputy Director with the School of Integrated Circuits, Tsinghua University. He has author...Show More
Baoyong Chi (Senior Member, IEEE) received the B.S. degree in microelectronics from Peking University, Beijing, China, in 1998, and the Ph.D. degree from Tsinghua University, Beijing, in 2003.
From 2006 to 2007, he was a Visiting Assistant Professor with Stanford University, Stanford, CA, USA. He is currently a Full Professor and the Deputy Director with the School of Integrated Circuits, Tsinghua University. He has author...View more

I. Introduction

Millimeter-wave (mm-wave) phased arrays for fifth-generation (5G) communication, radar, and satellite communication systems have obtained ever-increasing attention. Phased arrays enable electronically steerable beamforming, and thus, provide higher effective isotropic radiated power (EIRP) in transmitters (TXs) and better signal-to-noise ratio (SNR) in receivers (RXs) [1], [2]. For these potential application scenarios, a phased-array transceiver front-end must satisfy some critical performance requirements, as shown in Fig. 1. First, a high output power of the TX supports long-range communications and radar detection, making the power amplifier (PA) one of the most critical components in a phased-array transceiver front-end. Second, the T/R switch at the antenna port must have high linearity and low insertion loss (IL) to handle the large output power from the PA. Third, high-quality beamforming relates to 1) a wide range (phase shift (PS) range or gain control range), 2) fine resolution (minimum PS or gain control step), 3) high accuracy (evaluated as the rms phase/gain error compared to intended steps), and 4) good orthogonality of PS and gain control. This makes phase shifters and gain controllers crucial components in a phased-array transceiver front-end. The range, resolution, and accuracy of PS and gain control directly translate to beam steering range, resolution, and accuracy. Orthogonality is, however, often missed but is also of great importance. Beam steering and sidelobe suppression are directly determined by the phase shifter, which enables beam steering, and the gain controller, which achieves sidelobe suppression through tapering [3]. From a system perspective, it is imperative to achieve orthogonal beam steering and sidelobe suppression functions, which correspond to orthogonal PS and gain control in a phased-array transceiver front-end [4]. Correspondingly, from a circuit perspective, the PS and gain control in each element must be orthogonal as well. This circuit-level orthogonality requires the phase shifter to present a low gain or loss variation over different phase settings and the gain controller to present a low phase variation over different gain settings.

Block diagram of a typical phased-array transceiver front-end and performance requirements for critical components.

Author image of Pingda Guan
School of Integrated Circuits, Tsinghua University, Beijing, China
Pingda Guan received the B.S. degree from Tsinghua University, Beijing, China, in 2017, where he is currently pursuing the Ph.D. degree at the School of Integrated Circuits.
His current research interests are in the field of millimeter-wave (mm-wave) circuits and systems, including power amplifiers (PAs), voltage-controlled oscillators (VCOs), phased arrays, and wireless transceivers.
Pingda Guan received the B.S. degree from Tsinghua University, Beijing, China, in 2017, where he is currently pursuing the Ph.D. degree at the School of Integrated Circuits.
His current research interests are in the field of millimeter-wave (mm-wave) circuits and systems, including power amplifiers (PAs), voltage-controlled oscillators (VCOs), phased arrays, and wireless transceivers.View more
Author image of Haikun Jia
School of Integrated Circuits, Tsinghua University, Beijing, China
Haikun Jia (Member, IEEE) received the B.S. and Ph.D. degrees in electronics engineering from Tsinghua University, Beijing, China, in 2009 and 2015, respectively.
He is currently an Assistant Professor with the School of Integrated Circuits, Tsinghua University. His research interests are in the field of millimeter-wave and high-speed circuit and system design, including power amplifiers (PAs), voltage-controlled oscillators (VCOs), and frequency-modulated continuous-wave (FMCW) radars.
Haikun Jia (Member, IEEE) received the B.S. and Ph.D. degrees in electronics engineering from Tsinghua University, Beijing, China, in 2009 and 2015, respectively.
He is currently an Assistant Professor with the School of Integrated Circuits, Tsinghua University. His research interests are in the field of millimeter-wave and high-speed circuit and system design, including power amplifiers (PAs), voltage-controlled oscillators (VCOs), and frequency-modulated continuous-wave (FMCW) radars.View more
Author image of Wei Deng
School of Integrated Circuits, Tsinghua University, Beijing, China
Wei Deng (Senior Member, IEEE) received the B.S. and M.S. degrees from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2006 and 2009, respectively, and the Ph.D. degree from the Tokyo Institute of Technology, Tokyo, Japan, in 2013, all in electronic engineering.
From 2013 to 2014, he was a Post-Doctoral Researcher with the Tokyo Institute of Technology. From 2015 to 2019, he was with Apple Inc., Cupertino, CA, USA, working on radio frequency (RF), millimeter-wave (mm-wave), and mixed-signal IC design for wireless systems and Apple A-series processors. Since 2019, he has been with the School of Integrated Circuits, Tsinghua University, Beijing, China, where he is currently an Associate Professor. He has authored or coauthored more than 140 IEEE journal and conference papers. His research interests include RF, mm-wave, terahertz, and mixed-signal integrated circuits and systems for wireless communications, radars, and imaging systems.
Dr. Deng is a Technical Program Committee (TPC) Member of the IEEE International Solid-State Circuits Conference (ISSCC), the IEEE Symposium on VLSI Technology and Circuits (VLSI), the Custom Integrated Circuits Conference (CICC), and the IEEE European Solid-State Circuits Conference (ESSCIRC). He has been an Associate Editor of the IEEE Solid- State Circuits Letters (SSC-L). He was a recipient of several national and international awards, including the China Youth Science and Technology Innovation Award, the IEEE SSCS Predoctoral Achievement Award, the Chinese Government Award for Outstanding Self-Financed (nongovernment sponsored) Students Abroad, the Tejima Research Award, and the IEEE/ACM ASP-DAC Best Design Award.
Wei Deng (Senior Member, IEEE) received the B.S. and M.S. degrees from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2006 and 2009, respectively, and the Ph.D. degree from the Tokyo Institute of Technology, Tokyo, Japan, in 2013, all in electronic engineering.
From 2013 to 2014, he was a Post-Doctoral Researcher with the Tokyo Institute of Technology. From 2015 to 2019, he was with Apple Inc., Cupertino, CA, USA, working on radio frequency (RF), millimeter-wave (mm-wave), and mixed-signal IC design for wireless systems and Apple A-series processors. Since 2019, he has been with the School of Integrated Circuits, Tsinghua University, Beijing, China, where he is currently an Associate Professor. He has authored or coauthored more than 140 IEEE journal and conference papers. His research interests include RF, mm-wave, terahertz, and mixed-signal integrated circuits and systems for wireless communications, radars, and imaging systems.
Dr. Deng is a Technical Program Committee (TPC) Member of the IEEE International Solid-State Circuits Conference (ISSCC), the IEEE Symposium on VLSI Technology and Circuits (VLSI), the Custom Integrated Circuits Conference (CICC), and the IEEE European Solid-State Circuits Conference (ESSCIRC). He has been an Associate Editor of the IEEE Solid- State Circuits Letters (SSC-L). He was a recipient of several national and international awards, including the China Youth Science and Technology Innovation Award, the IEEE SSCS Predoctoral Achievement Award, the Chinese Government Award for Outstanding Self-Financed (nongovernment sponsored) Students Abroad, the Tejima Research Award, and the IEEE/ACM ASP-DAC Best Design Award.View more
Author image of Shengnan Dong
School of Integrated Circuits, Tsinghua University, Beijing, China
Shengnan Dong received the B.S. degree in microelectronics science and engineering from Xi’an Jiaotong University, Xi’an, China, in 2018, and the M.S. degree in integrated circuit engineering from Tsinghua University, Beijing, China, in 2021.
Her current research interests include millimeter-wave (mm-wave) circuits, phased array circuits and systems, and wireless transceiver design.
Shengnan Dong received the B.S. degree in microelectronics science and engineering from Xi’an Jiaotong University, Xi’an, China, in 2018, and the M.S. degree in integrated circuit engineering from Tsinghua University, Beijing, China, in 2021.
Her current research interests include millimeter-wave (mm-wave) circuits, phased array circuits and systems, and wireless transceiver design.View more
Author image of Xiangrong Huang
School of Integrated Circuits, Tsinghua University, Beijing, China
Xiangrong Huang (Graduate Student Member, IEEE) received the B.S. degree from the College of Astronautics, Harbin Institute of Technology, Harbin, China, in 2018. He is currently pursuing the Ph.D. degree at the Institute of Microelectronics, Tsinghua University, Beijing, China.
His research interests focus on millimeter-wave (mm-wave) circuits, frequency-modulated continuous-wave (FMCW) radar, phased array circuits and systems, and wireless transceiver design.
Xiangrong Huang (Graduate Student Member, IEEE) received the B.S. degree from the College of Astronautics, Harbin Institute of Technology, Harbin, China, in 2018. He is currently pursuing the Ph.D. degree at the Institute of Microelectronics, Tsinghua University, Beijing, China.
His research interests focus on millimeter-wave (mm-wave) circuits, frequency-modulated continuous-wave (FMCW) radar, phased array circuits and systems, and wireless transceiver design.View more
Author image of Zhihua Wang
School of Integrated Circuits, Tsinghua University, Beijing, China
Zhihua Wang (Fellow, IEEE) received the B.S., M.S., and Ph.D. degrees in electronic engineering from Tsinghua University, Beijing, China, in 1983, 1985, and 1990, respectively.
Since 1997, he has been a Full Professor with Tsinghua University. Since 2000, he has been the Deputy Director with the Institute of Microelectronics, Tsinghua University. From 1992 to 1993, he was a Visiting Scholar at Carnegie Mellon University, Pittsburgh, PA, USA. He was a Visiting with the KU Leuven, Leuven, Belgium, from 1993 to 1994. From September 2014 to March 2015, he was a Visiting Professor with The Hong Kong University of Science and Technology, Hong Kong. He has coauthored 13 books/chapters, over 225 (569) articles in international journals (conferences), over 251 (29) articles in Chinese journals (conferences), and holds 130 Chinese and ten U.S. patents. His current research mainly focuses on CMOS RFIC and biomedical applications involving RFID, PLL, low-power wireless transceivers, and smart clinic equipment combined with leading-edge RFIC and digital image processing techniques.
Dr. Wang was an AdCom Member of the IEEE SSCS from 2016 to 2019. He was a Technology Program Committee Member of the IEEE International Solid-State Circuits Conference (ISSCC) from 2005 to 2011. Since 2005, he was a Steering Committee Member of the IEEE A-SSCC. He has served as the Chairman of the IEEE SSCS Beijing Chapter from 1999 to 2009. He was the Technical Program Chair for A-SSCC 2013. He was the Guest Editor for the IEEE Journal of Solid- State Circuits (JSSC) Special Issue in December 2006, December 2009, and November 2014. During 2019–2020, he has been an Associate Editor in Chief of IEEE Open Journal of Circuits And Systems. He had been an Associate Editor of the IEEE Transactions on Circuits And Systems—I: Regular Papers during 2016–2019, IEEE Transactions on Circuits And Systems—II: Express Briefs during 2010–2013, IEEE Transactions on Biomedical Circuits and Systems (BioCAS) during 2008–2015, and other administrative/expert committee positions in China’s national science and technology projects. From 2018 to 2019, he was an IEEE SSCS Distinguished Lecturer. Since 2020, he has been an IEEE CASS Distinguished Lecturer.
Zhihua Wang (Fellow, IEEE) received the B.S., M.S., and Ph.D. degrees in electronic engineering from Tsinghua University, Beijing, China, in 1983, 1985, and 1990, respectively.
Since 1997, he has been a Full Professor with Tsinghua University. Since 2000, he has been the Deputy Director with the Institute of Microelectronics, Tsinghua University. From 1992 to 1993, he was a Visiting Scholar at Carnegie Mellon University, Pittsburgh, PA, USA. He was a Visiting with the KU Leuven, Leuven, Belgium, from 1993 to 1994. From September 2014 to March 2015, he was a Visiting Professor with The Hong Kong University of Science and Technology, Hong Kong. He has coauthored 13 books/chapters, over 225 (569) articles in international journals (conferences), over 251 (29) articles in Chinese journals (conferences), and holds 130 Chinese and ten U.S. patents. His current research mainly focuses on CMOS RFIC and biomedical applications involving RFID, PLL, low-power wireless transceivers, and smart clinic equipment combined with leading-edge RFIC and digital image processing techniques.
Dr. Wang was an AdCom Member of the IEEE SSCS from 2016 to 2019. He was a Technology Program Committee Member of the IEEE International Solid-State Circuits Conference (ISSCC) from 2005 to 2011. Since 2005, he was a Steering Committee Member of the IEEE A-SSCC. He has served as the Chairman of the IEEE SSCS Beijing Chapter from 1999 to 2009. He was the Technical Program Chair for A-SSCC 2013. He was the Guest Editor for the IEEE Journal of Solid- State Circuits (JSSC) Special Issue in December 2006, December 2009, and November 2014. During 2019–2020, he has been an Associate Editor in Chief of IEEE Open Journal of Circuits And Systems. He had been an Associate Editor of the IEEE Transactions on Circuits And Systems—I: Regular Papers during 2016–2019, IEEE Transactions on Circuits And Systems—II: Express Briefs during 2010–2013, IEEE Transactions on Biomedical Circuits and Systems (BioCAS) during 2008–2015, and other administrative/expert committee positions in China’s national science and technology projects. From 2018 to 2019, he was an IEEE SSCS Distinguished Lecturer. Since 2020, he has been an IEEE CASS Distinguished Lecturer.View more
Author image of Baoyong Chi
School of Integrated Circuits, Tsinghua University, Beijing, China
Baoyong Chi (Senior Member, IEEE) received the B.S. degree in microelectronics from Peking University, Beijing, China, in 1998, and the Ph.D. degree from Tsinghua University, Beijing, in 2003.
From 2006 to 2007, he was a Visiting Assistant Professor with Stanford University, Stanford, CA, USA. He is currently a Full Professor and the Deputy Director with the School of Integrated Circuits, Tsinghua University. He has authored over 140 academic articles and two books and holds more than 20 patents. His current research interests include radio frequency (RF)/millimeter-wave integrated circuit design, analog integrated circuit design, and monolithic wireless transceiver chips for radar and communication.
Dr. Chi has been a Technical Program Committee (TPC) Member of A-SSCC, since 2005.
Baoyong Chi (Senior Member, IEEE) received the B.S. degree in microelectronics from Peking University, Beijing, China, in 1998, and the Ph.D. degree from Tsinghua University, Beijing, in 2003.
From 2006 to 2007, he was a Visiting Assistant Professor with Stanford University, Stanford, CA, USA. He is currently a Full Professor and the Deputy Director with the School of Integrated Circuits, Tsinghua University. He has authored over 140 academic articles and two books and holds more than 20 patents. His current research interests include radio frequency (RF)/millimeter-wave integrated circuit design, analog integrated circuit design, and monolithic wireless transceiver chips for radar and communication.
Dr. Chi has been a Technical Program Committee (TPC) Member of A-SSCC, since 2005.View more
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