A Single-TSV and Single-DCDL Approach for Skew Compensation of Multi-Dies Clock Synchronization in 3-D-ICs

Existing methods used for the clock distribution of multiple dies employ a balanced tree structure to minimize the impact of the within-die process and loading variations. No topology for die-to-die clock skew compensation of more than two dies has been presented yet. This article presents a novel die-to-die clock skew compensation topology to address these limitations. Unlike existing designs, the proposed topology does not need a phase detector (hence, no dead zone); it only requires one through-silicon via (TSV) to connect a pair of dies and one digitally controlled delay line (DCDL) in each die; thus, there is no skew from extra TSVs and DCDLs. Accordingly, the system has a small chip area and low lock time. The postsynthesis of this work was accomplished in a 65-nm CMOS process. The performance of our design was evaluated theoretically and practically in terms of mismatch/finite resolution of delay lines, buffer mismatch, and TSV delay. Under identical conditions, the residual skew of the proposed design was as low as 13 ps at 1 GHz. This study is the first to obtain the solution for die-to-die clock synchronization of multiple dies (more than two dies) in a three-dimensional (3-D) integrated circuit, while other systems can only support two dies.