I. Introduction
Wide bandgap (WBG) semiconductor devices are ideally suited for high-power electronics due to material properties that provide improved efficiency and reduced size when compared to silicon-based counterparts [1]. These devices can withstand higher voltages and temperatures, with much lower ON-state resistance for a given die size when compared to a silicon equivalent. These characteristics have resulted in significantly more efficient power conversion. While there is a tremendous amount of data and knowledge associated with single-event radiation effects for silicon power devices, there is much less information available for WBG materials [2]. For example, SiC power devices have been shown to be susceptible to heavy-ion exposure, with catastrophic single-event burnout (SEB) occurring at biases as low as 40% of their rated breakdown voltage [3], [4].