Author details

Mike Folk

Also published under: M. Folk

Affiliation

The HDF Group

Publication Topics

Biography

Mike Folk photograph and biography not available at the time of publication.(Based on document published on 17 November 2008).

Publications

Citations

Publications by Year

19992019

Co-Authors:

Show All Co-Authors (11)

Author's Published Works

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Advanced 2.5D and 3D packaging technologies for next generation Silicon Photonics in high performance networking applications

Sandeep Razdan;Peter De Dobbelaere;Jie Xue;Aparna Prasad;Vipul Patel

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

Year: 2022 | Conference Paper |

Cited by: Papers (11)

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Advanced 2.5D and 3D packaging technologies for next generation Silicon Photonics in high performance networking applications

Sandeep Razdan;Peter De Dobbelaere;Jie Xue;Aparna Prasad;Vipul Patel

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

Year: 2022 | Conference Paper |

Trends and Challenges in Advanced Packaging Development for Silicon Photonics Beyond 400Gbps in Hyperscale Data Center Networking Applications

Jie Xue;Sandeep Razdan;Peter De Dobbelaere;Angelo Miele;Aparna Prasad;Tong Wang;Vipul Patel;Ginni Chadha

2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

Year: 2022 | Conference Paper |

Cited by: Papers (3)

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Trends and Challenges in Advanced Packaging Development for Silicon Photonics Beyond 400Gbps in Hyperscale Data Center Networking Applications

Jie Xue;Sandeep Razdan;Peter De Dobbelaere;Angelo Miele;Aparna Prasad;Tong Wang;Vipul Patel;Ginni Chadha

2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

Year: 2022 | Conference Paper |

3D SiP with Organic Interposer for ASIC and Memory Integration

Li Li;Pierre Chia;Paul Ton;Mohan Nagar;Sada Patil;Jie Xue;Javier Delacruz;Marius Voicu;Jack Hellings;Bill Isaacson;Mark Coor;Ross Havens

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

Year: 2016 | Conference Paper |

Cited by: Papers (48) | Patents (1)

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3D SiP with Organic Interposer for ASIC and Memory Integration

Li Li;Pierre Chia;Paul Ton;Mohan Nagar;Sada Patil;Jie Xue;Javier Delacruz;Marius Voicu;Jack Hellings;Bill Isaacson;Mark Coor;Ross Havens

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

Year: 2016 | Conference Paper |

Cost and performance effective silicon interposer and Vertical Interconnect for 3D ASIC and memory integration

Li Li;Mitsutoshi Higashi;Akihito Takano;Jie Xue;Gary Ikari

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

Year: 2014 | Conference Paper |

Cited by: Papers (3)

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Cost and performance effective silicon interposer and Vertical Interconnect for 3D ASIC and memory integration

Li Li;Mitsutoshi Higashi;Akihito Takano;Jie Xue;Gary Ikari

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

Year: 2014 | Conference Paper |

Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications

Heng-Chieh Chien;John H. Lau;Yu-Lin Chao;Ming-Ji Dai;Ra-Min Tain;L. Li;P. Su;J. Xue;M. Brillhart

2012 IEEE 62nd Electronic Components and Technology Conference

Year: 2012 | Conference Paper |

Cited by: Papers (35)

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Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications

Heng-Chieh Chien;John H. Lau;Yu-Lin Chao;Ming-Ji Dai;Ra-Min Tain;L. Li;P. Su;J. Xue;M. Brillhart

2012 IEEE 62nd Electronic Components and Technology Conference

Year: 2012 | Conference Paper |

Addressing bandwidth challenges in next generation high performance network systems with 3D IC integration

Li Li;Peng Su;Jie Xue;Mark Brillhart;John Lau;P. J. Tzeng;C. K. Lee;C. J. Zhan;M. J. Dai;H. C. Chien;S. T. Wu

2012 IEEE 62nd Electronic Components and Technology Conference

Year: 2012 | Conference Paper |

Cited by: Papers (29) | Patents (1)

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Addressing bandwidth challenges in next generation high performance network systems with 3D IC integration

Li Li;Peng Su;Jie Xue;Mark Brillhart;John Lau;P. J. Tzeng;C. K. Lee;C. J. Zhan;M. J. Dai;H. C. Chien;S. T. Wu

2012 IEEE 62nd Electronic Components and Technology Conference

Year: 2012 | Conference Paper |

Shear microprobing of chip-package interaction in advanced interconnect structures

A. W. Hsing;A. V. Kearney;L. Li;J. Xue;M. Brillhart;R. H. Dauskardt

2011 IEEE International Interconnect Technology Conference

Year: 2011 | Conference Paper |

Cited by: Papers (2)

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Shear microprobing of chip-package interaction in advanced interconnect structures

A. W. Hsing;A. V. Kearney;L. Li;J. Xue;M. Brillhart;R. H. Dauskardt

2011 IEEE International Interconnect Technology Conference

Year: 2011 | Conference Paper |