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L. Anderson - IEEE Xplore Author Profile

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Optimization of circuit performance and cost generally involves a trade-off between a) circuit design and die area efficiency plus shortest time to market with b) maintaining production efficiency of multiple process variants with multiple component lists. Key technology drivers were identified and redesigned in the LBC6 generation power BiCMOS process described herein to achieve a 40% die area re...Show More
Summary form only given as follows. Fast, high current Z-pinch implosions are used to produce intense X-ray pulses for various applications. For high-energy photon production and for inertial fusion applications, the imploding Z pinch can achieve velocities between 50 and 100 cm//spl mu/s. To image such implosions, a high time resolution is needed. Furthermore, the final pinches formed can be only...Show More
A new fast electrical technique for the detection of mobile ions in silicon processes using a simple field oxide test structure is presented. The method is ideal for WLR monitoring of mobile ions since its throughput is much higher than conventional slower methods such as the BTS (bias temperature sweep) method. The technique is based upon biasing a field oxide FET in a configuration resembling a ...Show More
This case study shows how to use Triangular Voltage Sweep (TVS) to reduce Na and K in the backend of a triple-metal BiCMOS process from 10/sup 12/ ions/cm/sup 2/ to 10/sup 10/ ions/cm/sup 2/. TVS is compared to Bias Temperature Stress (BTS) techniques. While Capacitance-Voltage plots are good monitors for bulk contamination (metal, deposited oxide, etc.), data is presented which shows that TVS is ...Show More