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Photo-Induced Fermi Level Modulation of Graphene FETs: Expression Mechanism and Potential as Chemical Sensors
Yoshiaki Sugizaki;Yasutaka Nishida;Akiko Yuzawa;Miyu Nagai;Hiroko Miki;Hiroshi Hamasaki;Kazunori Motai;Yuhei Hayamizu;Miyuki Tabata;Yuji Miyahara;Atsunobu Isobayashi;Hideki Shibata;Hideyuki Tomizawa
2023 IEEE Nanotechnology Materials and Devices Conference (NMDC)
Year: 2023 | Conference Paper |
Graphene FETs immobilized with some anions show extremely large modulation of the Fermi level upon light irradiation. The mechanism of the modulation is suggested to be the charge transfer between graphene and the anion, which makes photogating effect resulting from capacitive coupling of electrons or holes injection in the anion. We also found that the photo-response could be utilized as a chemic...Show More
Photo-Induced Fermi Level Modulation of Graphene FETs: Expression Mechanism and Potential as Chemical Sensors
Yoshiaki Sugizaki;Yasutaka Nishida;Akiko Yuzawa;Miyu Nagai;Hiroko Miki;Hiroshi Hamasaki;Kazunori Motai;Yuhei Hayamizu;Miyuki Tabata;Yuji Miyahara;Atsunobu Isobayashi;Hideki Shibata;Hideyuki Tomizawa
Year: 2023 | Conference Paper |
A high-sensitivity olfactory system with a graphene FET biosensor and a portable odorant capture module
Hideyuki Tomizawa;Kou Yamada;Hiroshi Hamasaki;Yoshiaki Sugizaki;Miyuki Tabata;Yuji Miyahara;Atsunobu Isobayashi
2021 International Conference on Electronics Packaging (ICEP)
Year: 2021 | Conference Paper |
Cited by: Papers (1)
In this paper, we report the demonstration of odorant capture and detection with a high-sensitivity olfactory system having a membrane-type odorant capture module. We carried out the odorant capture experiment with limonene and skatole gases as representative odorants, and the captured concentration was 7.6 nM and 0.2 µM, respectively. Furthermore, we have demonstrated 10 nM sensitivity by the gra...Show More
Ionic Liquids With Wafer-Scalable Graphene Sensors for Biological Detection
Hiroko Miki;Atsunobu Isobayashi;Tatsuro Saito;Yoshiaki Sugizaki
Ionic liquids, known as non-volatile solvents, have potential for realizing microanalysis with a minute quantity of sample. Here, in this paper, we report the measurement of the Id-Vg characteristics during the enzymatic catalytic reactions and streptavidin-biotin binding in ionic liquids by using the graphene FET sensors we fabricated, and successfully-monitored the biological reactions in much s...Show More
Novel Bonding Process Using Ultra-thin Mn for Highly Robust and Reliable Cu/SiO Hybrid Bonding
Kengo Uchida;Kazumichi Tsumura;Kenro Nakamura;Kazuyuki Higashi;Yoshiaki Sugizaki;Hideki Shibata
2018 IEEE International Interconnect Technology Conference (IITC)
Year: 2018 | Conference Paper |
Cited by: Papers (3)
We propose a new Cu/SiO hybrid bonding process using ultrathin Mn film at the bonding interface. In this process, bonding stability is improved because the bonding interface consists of only Mn. In addition, Mn on SiO forms a MnSiO, which is known as a diffusion barrier for Cu during thermal processing, resulting in improved reliability of interconnects in areas of misalignment. To demonstrate the...Show More
Backside Optical I/O Module for Si Photonics Integrated with Electrical ICs Using Fan-Out Wafer Level Packaging Technology
Hiroshi Uemura;Kaori Warabi;Kazuya Ohira;Yoichiro Kurita;Haruhiko Yoshida;Hideto Furuyama;Yoshiaki Sugizaki;Hideki Shibata
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
Year: 2018 | Conference Paper |
Cited by: Papers (6)
We propose a novel Si photonics module that overcomes the issues of conventional Si photonics modules such as package structure and electrical connection. The module incorporates an optical fiber socket fabricated by blind via socket (BVS) technology, which implements backside optical I/O in a photonic IC (PIC) by forming blind via holes on the backside. High-speed high-density electrical connecti...Show More
The effects of poly-SiGe on sensing properties for ultra-low-power CMOS-embedded MEMS sensors
Yoshihiko Kurui;Hideyuki Tomizawa;Akira Fujimoto;Tomohiro Saito;Akihiro Kojima;Tamio Ikehashi;Yoshiaki Sugizaki;Hideki Shibata
To compare Si and poly-SiGe as MEMS structural materials having 20 pm-thick, we fabricated a capacitive accelerometer on an 8-inch Si substrate using CMOS standard process and measured capacitance sensitivities of an identical sensor design. As a result, we found that the sensitivity of the SiGe sensor is 2.1 times larger than that of the Si sensor. We also confirmed that the SiGe sensor can attai...Show More
Novel ESD-suppressing material: Voltage-dependent resistor (VDR) resin with ZnO-based ceramic fillers
Yoshiaki Sugizaki;Junya Kusunoki;Aya Nakamoto;Miyuki Shimojuku;Hideto Furuyama
2016 6th Electronic System-Integration Technology Conference (ESTC)
Year: 2016 | Conference Paper |
This paper presents a novel encapsulation resin that can relieve the impact of electrostatic discharge (ESD) on electronic devices. The encapsulation resin employs ZnO-based ceramic varistor particles instead of SiO2 fillers. It shows a typical voltage-dependent resistance (VDR) property, i.e., steep resistance drop with the rise of applied voltage. To adopt the resin (hereinafter referred to as t...Show More
Evaluation of gas permeability for micro-scale thin polymer film with encapsulated MEMS damped oscillator
Ryunosuke Gando;Naofumi. Nakamura;Yumi Hayashi;Daiki. Ono;Kei Masunishi;Yasushi Tomizawa;Hiroaki Yamazaki;Tamio Ikehashi;Yoshiaki Sugizaki;Hideki Shibata
We present a practical method to evaluate gas permeability for thin polymer films using an encapsulated micro-electro-mechanical-system (MEMS) oscillator. Previously, we have developed a hermetic thin-film dome structure for RF-MEMS tunable capacitor, using conventional back-end-of-the-line (BEOL) processes. The dome is made of multiple layers including a polymer film, whose gas permeability is an...Show More
A damage-free sapphire substrate removal process to realize highly manufacturable wafer-level white LED package
Miyuki Shimojuku;Akihiro Kojima;Miyoko Shimada;Hideyuki Tomizawa;Yosuke Akimoto;Hideto Furuyama;Yoshiaki Sugizaki;Hideki Shibata
2013 3rd IEEE CPMT Symposium Japan
Year: 2013 | Conference Paper |
Ultracompact 4 × 3.4 Gbps optoelectronic package for an active optical HDMI cable
Norbert Schlepple;Michihiko Nishigaki;Hiroshi Uemura;Hideto Furuyama;Yoshiaki Sugizaki;Hideki Shibata;Yasuhiro Koike
Refering to the increasing demand for extended transmission distances of high-definition video in consumer electronics we present a composite optoelectronic high-definition multimedia interface (HDMI) cable that replaces the four electrical transition-minimized differential signal video channels by a 4×3.4 Gb/s optical fiber link, the currently maximum specified bit rate. This improves the signal ...Show More
A fully integrated novel Wafer-Level LED package (WL2P) technology for extremely low-cost solid state lighting devices
Akihiro Kojima;Miyoko Shimada;Yosuke Akimoto;Miyuki Shimojuku;Hideto Furuyama;Susumu Obata;Kazuhito Higuchi;Yoshiaki Sugizaki;Hideki Shibata
2012 IEEE International Interconnect Technology Conference
Year: 2012 | Conference Paper |
Reduction of cost has become the most important challenge for solid state lighting. We proposed a novel Wafer-Level LED Packaging (WL2P) technology, which enables both extremely low cost and small size for future solid state lighting. Where a conventional package needs individual assembly steps, resulting in high fabrication cost, we carried out from growth of the GaN layer, over formation of Inte...Show More
Ultralow EMI interconnection module for mobile devices using 3D-flexible hybrid multi-fin optoelectronic FPC
Hiroshi Uemura;Kentaro Kobayashi;Kohei Hiyama;Hideto Furuyama;Yoshiaki Sugizaki;Hideki Shibata
2012 IEEE 62nd Electronic Components and Technology Conference
Year: 2012 | Conference Paper |
Cited by: Papers (1)
An optoelectronic interconnection module for mobile devices is required to have not only optical interconnection for high-speed and noise-free signal transmission but also many electrical wirings for multiple power supplies and low-speed signal transmission. It leads to great challenges of cost increase, flexibility degradation and electromagnetic noise emission. We propose a novel optoelectronic ...Show More
A CMOS embedded RF-MEMS tunable capacitor for multi-band/multi-mode smartphones
Y. Kurui;H. Yamazaki;Y. Shimooka;T. Saito;E. Ogawa;T. Ogawa;T. Ikehashi;Y. Sugizaki;H. Shibata
2012 IEEE 62nd Electronic Components and Technology Conference
Year: 2012 | Conference Paper |
Cited by: Papers (3)
This paper reports on 1-chip RF-MEMS tunable capacitor that equips CMOS driver circuit in the underlying layer. A Wafer Level Chip Scale Package (WLCSP) optimized for RF-MEMS is employed to minimize the module size. The MEMS actuation voltage is generated by an Actuation Voltage Generator (AVG). The boost mechanism employed in the AVG enables instant high voltage generation and reduction of the di...Show More
4$\,\times\,$10 Gb/s High-Speed Link Over Thin GI 50/125 Plastic Optical Fibers and Compact Optical Sub-Assembly
Norbert Schlepple;Michihiko Nishigaki;Hiroshi Uemura;Kei Obara;Hideto Furuyama;Yoshiaki Sugizaki;Hideki Shibata;Yasuhiro Koike
IEEE Photonics Technology Letters
Cited by: Papers (4)
We introduce an extremely thin 50/125 perfluorinated graded-index plastic optical fiber (POF) and its application in a 4×10 Gb/s optical link including our optical sub-assembly (OSA). We outline the main characteristics of the POF before the introduction of the fibers to our already established OSA is explained. Particularly low attenuation with error-free transmission down to a bending radius of ...Show More
A long-term reliability analysis of a creep-immune RF-MEMS tunable capacitor
Etsuji Ogawa;Kei Masunishi;Tamio Ikehashi;Tomohiro Saito;Hiroaki Yamazaki;Yasushi Tomizawa;Yoshiaki Sugizaki
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference
Year: 2011 | Conference Paper |
Cited by: Papers (2)
Actuators used in RF-MEMS tunable capacitors have an issue of creep-induced deformation. The creep is caused by a ductile-metal beam which is indispensable to attain the low loss. To avoid this issue, we previously reported an actuator structure that uses a brittle material, silicon nitride (SiN), at the stress-concentrated spring portions [1]. The present paper aims to clarify a long-term creep i...Show More
A high power-handling RF MEMS tunable capacitor using quadruple series capacitor structure
Hiroaki Yamazaki;Tamio Ikehashi;Tomohiro Saito;Etsuji Ogawa;Takayuki Masunaga;Tatsuya Ohguro;Yoshiaki Sugizaki;Hideki Shibata
2010 IEEE MTT-S International Microwave Symposium
Year: 2010 | Conference Paper |
This paper presents an RF MEMS tunable capacitor that achieves an excellent power-handling property with relatively low actuation voltage. The tunable capacitor consists of two fixed MIM (Metal-Insulator-Metal) capacitors and two MEMS capacitor elements, all connected in series. This quadruple series capacitor (QSC) structure enables reduction of the actuation voltage without sacrificing the power...Show More
Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor
Akihiro Kojima;Yoshiaki Shimooka;Yoshiaki Sugizaki;Mitsuyoshi Endo;Hiroaki Yamazaki;Etsuji Ogawa;Tamio Ikehashi;Tatsuya Ohguro;Susumu Obata;Takeshi Miyagi;Ikuo Mori;Yoshiaki Toyoshima;Hideki Shibata
TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference
Year: 2009 | Conference Paper |
Cited by: Papers (6)
In this paper, we report a thin-film encapsulation technology for wafer-level microelectromechanical systems (MEMS) variable capacitor package. The electrical characteristics of MEMS are adversely affected by moisture. In order to prevent moisture from permeating into a package, the top surface was protected with a plasma-enhanced chemical vapor deposition (PE-CVD) SiN layer. The developed package...Show More
Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor
Akihiro Kojima;Yoshiaki Shimooka;Yoshiaki Sugizaki;Mitsuyoshi Endo;Hiroaki Yamazaki;Etsuji Ogawa;Tamio Ikehashi;Tatsuya Ohguro;Susumu Obata;Takeshi Miyagi;Ikuo Mori;Yoshiaki Toyoshima;Hideki Shibata
Year: 2009 | Conference Paper |
An RF MEMS Variable Capacitor with Intelligent Bipolar Actuation
Tamio Ikehashi;Takayuki Miyazaki;Hiroaki Yamazaki;Atsushi Suzuki;Etsuji Ogawa;Shinji Miyano;Tomohiro Saito;Tatsuya Ohguro;Takeshi Miyagi;Yoshiaki Sugizaki;Nobuaki Otsuka;Hideki Shibata;Yoshiaki Toyoshima
2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers
Year: 2008 | Conference Paper |
We propose an IBA scheme based on a pull-out detection, which is suitable for implementing in a circuit. The scheme is implemented in a driver IC that is part of a module with an RF MEMS variable capacitor. No failures are observed over 108 cycles at 85degC, which is an accelerated charging condition.Show More
Robust hermetic wafer level thin-film encapsulation technology for stacked MEMS / IC package
Y. Shimooka;M. Inoue;M. Endo;S. Obata;A. Kojima;T. Miyagi;Y. Sugizaki;I. Mori;H. Shibata
2008 58th Electronic Components and Technology Conference
Year: 2008 | Conference Paper |
This paper reports a thin-film encapsulation technology for wafer level micro-electro-mechanical systems (MEMS) package, using poly-benzo-oxazole (PBO) sacrificial material and plasma enhanced chemical vapor deposited silicon oxide (PECVD SiO) cap layer. This technique, which is applicable for MEMS technologies, saves die size and enables conventional package processes such as dicing, picking, mou...Show More
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