A thin film multichip module which utilizes very high density wiring on a silicon substrate has been developed. The technology has been demonstrated using the IBM RISC (reduced instruction set computer) System/6000 processor as a vehicle. The prototype module contains a RISC processor consisting of nine CMOS VLSI chips. The package also contains decoupling capacitors and has 684 I/O. The substrate...Show More
This paper presents a study of chemical interactions between polymer surfaces and metal atoms deposited from the vapor phase. Such interactions may play an important role in interfacial metal-polymer adhesion. The chemical nature of the interface formed when an electropositive metal (chromium or cesium) is deposited onto the surface of PMDA-ODA polyimide has been investigated using chemical model ...Show More
