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Mark Sheplak - IEEE Xplore Author Profile
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Mark Sheplak

Also published under: M. Sheplak

Publications
30
Citations
574
Publications by Year
19972024
Co-Authors:
Show All Co-Authors (55)
Image of author Mark Sheplak

Mark Sheplak

Also published under: M. Sheplak

Affiliation

Electrical & Computer Engineering
University of Florida
Gainesville, USA

Publication Topics

Biography

Mark Sheplak (Member, IEEE) received the B.S., M.S., and Ph.D. degrees in mechanical engineering from Syracuse University, Syracuse, NY, USA, in 1989, 1992, and 1995, respectively.,He is currently a Professor holding joint appointments with the Department of Mechanical and Aerospace Engineering and the Department of Electrical and Computer Engineering, University of Florida (UF). Prior to joining UF in 1998, he was a Postdoctoral Associate with the Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA, USA, from 1995 to 1998. His current research focuses on the design, fabrication, and characterization of high-performance, instrumentation-grade, MEMS-based sensors and actuators that enable the measuremen...
Publications
30
Citations
574
Publications by Year
19972024
Co-Authors:
Show All Co-Authors (55)
Author's Published Works

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Gallium Nitride (GaN) MEMS Lamb Wave Resonators Operating At High Temperature Up To 800°C

Wen Sui;Mark Sheplak;Philip X.-L. Feng

2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)
Year: 2024 | Conference Paper |
Cited by: Papers (1)
We report on the first experimental demonstration of gallium nitride microelectromechanical Lamb wave resonators operating at high temperature up to 800°C, while retaining robust electromechanical resonances at ~32MHz and good quality factor of Q=450 at 800°C. The resonance frequency decreases linearly as temperature is being increased, demonstrating an excellent temperature coefficient of resonan...Show More

Gallium Nitride (GaN) MEMS Lamb Wave Resonators Operating At High Temperature Up To 800°C

Wen Sui;Mark Sheplak;Philip X.-L. Feng

Year: 2024 | Conference Paper |

A MEMS-Based Fast-Response Miniature Five-Hole Probe With Optical Pressure Transducers

Haocheng Zhou;Mark Sheplak

Journal of Microelectromechanical Systems
Year: 2020 | Volume: 29, Issue: 5 | Journal Article |
Cited by: Papers (4)
This paper presents the first realization of a fiberoptic lever-based, miniature five-hole probe (511P) for aerodynamic flow angle sensing applications. Five MEMS optical transducers are embedded in a hemispheric probe tip to mitigate the pneumatic lag problem of conventional 511P technology. A silicon die with five optical pressure transducers of 400 μm radius is microfabricated from a silicon-on...Show More

A MEMS-Based Fast-Response Miniature Five-Hole Probe With Optical Pressure Transducers

Haocheng Zhou;Mark Sheplak

Year: 2020 | Volume: 29, Issue: 5 | Journal Article |

A Flush-Mounted Dual-Axis Wall Shear Stress Sensor

Brett R. Freidkes;David A. Mills;William C. Patterson;Philip M. Fournier;Mark Sheplak

Journal of Microelectromechanical Systems
Year: 2020 | Volume: 29, Issue: 5 | Journal Article |
Cited by: Papers (2)
This paper presents the fabrication, packaging, and calibration of a flush-mounted, dual-axis, differential capacitive wall shear stress sensor. The two-mask fabrication process produces a 7-mm die with a 2-mm by 2-mm floating element supported by eight, compliant crab-leg tethers. Taking advantage of backside wire bonds, the hydraulically smooth package is suitable for wind tunnel testing and is ...Show More

A Flush-Mounted Dual-Axis Wall Shear Stress Sensor

Brett R. Freidkes;David A. Mills;William C. Patterson;Philip M. Fournier;Mark Sheplak

Year: 2020 | Volume: 29, Issue: 5 | Journal Article |

A Passive Wireless Microelectromechanical Pressure Sensor for Harsh Environments

John E. Rogers;Yong-Kyu Yoon;Mark Sheplak;Jack W. Judy

Journal of Microelectromechanical Systems
Year: 2018 | Volume: 27, Issue: 1 | Journal Article |
A microelectromechanical systems (MEMS) capacitive-type passive wireless pressure sensor designed to operate in harsh environments at temperatures up to 1000 °C is presented. The pressure sensor has a sapphire-based diaphragm and structural body, and a platinum-based capacitive element. The capacitive element is configured as a part of a slot patch antenna that is designed to operate in a far-fiel...Show More

A Passive Wireless Microelectromechanical Pressure Sensor for Harsh Environments

John E. Rogers;Yong-Kyu Yoon;Mark Sheplak;Jack W. Judy

Year: 2018 | Volume: 27, Issue: 1 | Journal Article |

A system for vector measurement of aerodynamic wall shear stress

Casey Barnard;David Mills;Mark Sheplak

2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)
Year: 2017 | Conference Paper |
Cited by: Papers (3)
This paper describes a sensor system designed for vector measurement of aerodynamic wall shear stress. The microelectromechanical systems (MEMS) prototype utilizes a serpentine tether flexure for dual-axis in-plane motion. Capacitive gap pairs coupled to a multi-frequency modulation/demodulation system allow for independent transduction across both axes. Sensor performance includes an average dyna...Show More

A system for vector measurement of aerodynamic wall shear stress

Casey Barnard;David Mills;Mark Sheplak

Year: 2017 | Conference Paper |

An instrumentation grade wall shear stress sensing system

Casey Barnard;Jessica Meloy;Mark Sheplak

2016 IEEE SENSORS
Year: 2016 | Conference Paper |
Cited by: Papers (1)
This paper describes development of a MEMS wall shear stress sensor system to be used in wind tunnel applications. An analog synchronous modulation and demodulation interface circuit allows for both ac and dc measurement of varying capacitance, yielding real-time dynamic and mean flow information with a low noise floor. Directional information of the input flow is retained throughout the system wi...Show More

An instrumentation grade wall shear stress sensing system

Casey Barnard;Jessica Meloy;Mark Sheplak

Year: 2016 | Conference Paper |

Development of a sapphire optical wall shear stress sensor for high-temperature applications

D. Mills;D. Blood;M. Sheplak

2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)
Year: 2015 | Conference Paper |
Cited by: Papers (4)
This paper presents the development of the first sapphire micromachined wall shear stress sensor for high-temperature applications utilizing geometric moiré optical transduction. A folded tether floating element structure is employed to extend the linear operating range of the sensor. Picosecond pulsed laser micro-machining processes are developed for patterning of mechanical structures in sapphir...Show More

Development of a sapphire optical wall shear stress sensor for high-temperature applications

D. Mills;D. Blood;M. Sheplak

Year: 2015 | Conference Paper |

Design and Analysis of Scanning Probe Microscopy Cantilevers With Microthermal Actuation

Bijoyraj Sahu;Robert O. Riddle;Daniel Ross;Mark Sheplak;Kam K. Leang;Curtis R. Taylor

Journal of Microelectromechanical Systems
Year: 2015 | Volume: 24, Issue: 6 | Journal Article |
Cited by: Papers (2)
The scanning probe microscope has revolutionized our ability to image and characterize the physical and chemical properties of material with atomic resolution. It has evolved as a versatile instrument for nanofabrication including atomic deposition, nanolithography, nanomachining, atomic manipulation, and assembly. However, in order to enable practical nanofabrication with scanning probe tips, it ...Show More

Design and Analysis of Scanning Probe Microscopy Cantilevers With Microthermal Actuation

Bijoyraj Sahu;Robert O. Riddle;Daniel Ross;Mark Sheplak;Kam K. Leang;Curtis R. Taylor

Year: 2015 | Volume: 24, Issue: 6 | Journal Article |

An AlN MEMS Piezoelectric Microphone for Aeroacoustic Applications

Matthew D. Williams;Benjamin A. Griffin;Tiffany N. Reagan;James R. Underbrink;Mark Sheplak

Journal of Microelectromechanical Systems
Year: 2012 | Volume: 21, Issue: 2 | Journal Article |
This paper describes the development of a micromachined microphone for aircraft fuselage arrays that are utilized by aeroacousticians to help identify aircraft noise sources and/or assess the effectiveness of noise-reduction technologies. The developed microphone utilizes piezoelectric transduction via an integrated aluminum nitride layer in a thin-film composite diaphragm. A theoretical lumped el...Show More

An AlN MEMS Piezoelectric Microphone for Aeroacoustic Applications

Matthew D. Williams;Benjamin A. Griffin;Tiffany N. Reagan;James R. Underbrink;Mark Sheplak

Year: 2012 | Volume: 21, Issue: 2 | Journal Article |

Thermoelastic Ultrasonic Actuator With Piezoresistive Sensing and Integrated Through-Silicon Vias

Benjamin A. Griffin;Venkataraman Chandrasekaran;Mark Sheplak

Journal of Microelectromechanical Systems
Year: 2012 | Volume: 21, Issue: 2 | Journal Article |
Cited by: Papers (10)
This paper presents technology development toward the goal of a micromachined acoustic proximity sensor for real-time cavity monitoring of underwater high-speed super-cavitating vehicles. Low-resistance polysilicon-based through-silicon vias (TSVs) have been integrated with the device to enable backside contacts for drive and sense circuitry. The sensor and vias were fabricated in a complementary-...Show More

Thermoelastic Ultrasonic Actuator With Piezoresistive Sensing and Integrated Through-Silicon Vias

Benjamin A. Griffin;Venkataraman Chandrasekaran;Mark Sheplak

Year: 2012 | Volume: 21, Issue: 2 | Journal Article |

Microfabricated silicon-on-Pyrex passive wireless wall shear stress sensor

Jeremy Sells;Vijay Chandrasekharan;Jessica Meloy;Mark Sheplak;Henry Zmuda;David P. Arnold

SENSORS, 2011 IEEE
Year: 2011 | Conference Paper |
Cited by: Papers (1)
This paper presents the design, fabrication, and characterization of a passive wireless sensor for the measurement of wall shear stress. A micromachined variable-capacitor shear stress transducer is realized using a silicon-on-Pyrex microfabrication process. The design features a diamond-shaped 2.25 mm2 silicon floating-element to accommodate more comb fingers for improved capacitive transduction ...Show More

Microfabricated silicon-on-Pyrex passive wireless wall shear stress sensor

Jeremy Sells;Vijay Chandrasekharan;Jessica Meloy;Mark Sheplak;Henry Zmuda;David P. Arnold

Year: 2011 | Conference Paper |

Hardware implementation of wideband time domain Robust Capon Beamforming

Xin Guan;Henry Zmuda;Jian Li;Lin Du;Mark Sheplak

2011 IEEE International Symposium on Antennas and Propagation (APSURSI)
Year: 2011 | Conference Paper |
Cited by: Papers (3)
Capon Beamforming algorithm is an optimal spatial filtering algorithm used in various signal processing applications where excellent interference rejection performance is required, such as Radar and Sonar systems, Smart Antenna systems for wireless communications. Its lack of robustness, however, means that it is vulnerable to array calibration errors and other model errors. To overcome this probl...Show More

Hardware implementation of wideband time domain Robust Capon Beamforming

Xin Guan;Henry Zmuda;Jian Li;Lin Du;Mark Sheplak

Year: 2011 | Conference Paper |

A Microscale Differential Capacitive Direct Wall-Shear-Stress Sensor

Vijay Chandrasekharan;Jeremy Sells;Jessica Meloy;David P. Arnold;Mark Sheplak

Journal of Microelectromechanical Systems
Year: 2011 | Volume: 20, Issue: 3 | Journal Article |
This paper presents the development of a floating-element-based capacitively sensed direct wall-shear-stress sensor intended for measurements in a turbulent boundary layer. The design principle is presented, followed by details of the fabrication, packaging, and characterization process. The sensor is designed with an asymmetric comb finger structure and metalized electrodes. The fabrication proce...Show More

A Microscale Differential Capacitive Direct Wall-Shear-Stress Sensor

Vijay Chandrasekharan;Jeremy Sells;Jessica Meloy;David P. Arnold;Mark Sheplak

Year: 2011 | Volume: 20, Issue: 3 | Journal Article |

Aluminum Nitride Ultrasonic Air-Coupled Actuator

Benjamin A. Griffin;Matthew D. Williams;Chase S. Coffman;Mark Sheplak

Journal of Microelectromechanical Systems
Year: 2011 | Volume: 20, Issue: 2 | Journal Article |
Cited by: Papers (26)
A piezoelectric micromachined ultrasonic radiator was developed using aluminum nitride (AlN) for air-coupled applications. A commercially proven CMOS-compatible fabrication process was leveraged to form the devices. The transducer design consists of a radially nonuniform circular composite diaphragm with an integrated layer of AlN between two annular electrodes. Included in the overall system desi...Show More

Aluminum Nitride Ultrasonic Air-Coupled Actuator

Benjamin A. Griffin;Matthew D. Williams;Chase S. Coffman;Mark Sheplak

Year: 2011 | Volume: 20, Issue: 2 | Journal Article |

A metal-on-silicon differential capacitive shear stress sensor

V. Chandrasekharan;J. Sells;J. Meloy;D.P. Arnold;M. Sheplak

TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference
Year: 2009 | Conference Paper |
The paper presents a direct, capacitive shear stress sensor with performance sufficient for time-resolved turbulence measurements. The device employs a bulk-micromachined, metal-plated, differential capacitive floating-element design. A simple, two-mask fabrication process is used with DRIE on an SOI wafer to form a tethered floating element structure with comb fingers for transduction. Experiment...Show More

A metal-on-silicon differential capacitive shear stress sensor

V. Chandrasekharan;J. Sells;J. Meloy;D.P. Arnold;M. Sheplak

Year: 2009 | Conference Paper |

Harmonic Balance Nonlinear Identification of a Capacitive Dual-Backplate MEMS Microphone

Jian Liu;David T. Martin;Toshikazu Nishida;Louis N. Cattafesta;Mark Sheplak;Brian P. Mann

Journal of Microelectromechanical Systems
Year: 2008 | Volume: 17, Issue: 3 | Journal Article |
This paper describes the application of a nonlinear identification method to extract model parameters from the steady-state response of a capacitive dual-backplate microelectromechanical systems microphone. The microphone is modeled as a single-degree-of-freedom second-order system with both electrostatic and mechanical nonlinearities. A harmonic balance approach is applied to the nonlinear govern...Show More

Harmonic Balance Nonlinear Identification of a Capacitive Dual-Backplate MEMS Microphone

Jian Liu;David T. Martin;Toshikazu Nishida;Louis N. Cattafesta;Mark Sheplak;Brian P. Mann

Year: 2008 | Volume: 17, Issue: 3 | Journal Article |

P2F-2 Vibration of Post-Buckled Homogeneous Circular Plates

M. Williams;B. Griffin;B. Homeijer;B. Sankar;M. Sheplak

2007 IEEE Ultrasonics Symposium Proceedings
Year: 2007 | Conference Paper |
Cited by: Papers (2)
The dynamic behavior of an axisymmetric post- buckled circular plate with initial in-plane compression loading is investigated. The static von Karman plate equations are solved numerically for clamped boundary conditions. The static solution is presented for a range of transverse and in-plane loads. Lumped element modeling is used to calculate the mass and compliance of the plate from results of t...Show More

P2F-2 Vibration of Post-Buckled Homogeneous Circular Plates

M. Williams;B. Griffin;B. Homeijer;B. Sankar;M. Sheplak

Year: 2007 | Conference Paper |

The Nonlinear Behavior of a Post-Buckled Circular Plate

Matt Williams;Benjamin Griffin;Brian Homeijer;Bhavani Sankar;Mark Sheplak

SENSORS, 2007 IEEE
Year: 2007 | Conference Paper |
Cited by: Papers (3)
The axisymmetric post-buckling behavior of a circular plate with initial in-plane compression loading is investigated. The von Karman plate equations are solved numerically for a clamped plate and solutions are presented for a range of transverse and in-plane loadings. These solutions can be used to predict the post-buckled behavior of microscale diaphragms. A tradeoff between sensitivity and line...Show More

The Nonlinear Behavior of a Post-Buckled Circular Plate

Matt Williams;Benjamin Griffin;Brian Homeijer;Bhavani Sankar;Mark Sheplak

Year: 2007 | Conference Paper |

Design, Modeling and Simulation of a Closed-Loop Controller for a Dual Backplate MEMS Capacitive Microphone

Karthik Kadirvel;David T. Martin;Jian Liu;Robert Fox;Mark Sheplak;Louis N. Cattafesta;Toshikazu Nishida

SENSORS, 2007 IEEE
Year: 2007 | Conference Paper |
Cited by: Patents (2)
This work reports the design, modeling and simulation of an all electrostatic, analog closed-loop controller for a dual backplate MEMS capacitive microphone. In this work, a Simulink model which incorporates the key dynamics of the sensor, interface circuit, and sense and feedback non-linearities has been developed. Sinusoidal and step response of the open and closed loop systems were simulated. T...Show More

Design, Modeling and Simulation of a Closed-Loop Controller for a Dual Backplate MEMS Capacitive Microphone

Karthik Kadirvel;David T. Martin;Jian Liu;Robert Fox;Mark Sheplak;Louis N. Cattafesta;Toshikazu Nishida

Year: 2007 | Conference Paper |

A Micromachined Dual-Backplate Capacitive Microphone for Aeroacoustic Measurements

David T. Martin;Jian Liu;Karthik Kadirvel;Robert M. Fox;Mark Sheplak;Toshikazu Nishida

Journal of Microelectromechanical Systems
Year: 2007 | Volume: 16, Issue: 6 | Journal Article |
This paper presents the development of a micro-machined dual-backplate capacitive microphone for aeroacoustic measurements. The device theory, fabrication, and characterization are discussed. The microphone is fabricated using the five-layer planarized-polysilicon SUMMiT V process at Sandia National Laboratories. The microphone consists of a 0.46-mm-diameter 2.25-mum-thick circular diaphragm and t...Show More

A Micromachined Dual-Backplate Capacitive Microphone for Aeroacoustic Measurements

David T. Martin;Jian Liu;Karthik Kadirvel;Robert M. Fox;Mark Sheplak;Toshikazu Nishida

Year: 2007 | Volume: 16, Issue: 6 | Journal Article |

Multifrequency Microwave-Induced Thermal Acoustic Imaging for Breast Cancer Detection

Bin Guo;Jian Li;Henry Zmuda;Mark Sheplak

IEEE Transactions on Biomedical Engineering
Year: 2007 | Volume: 54, Issue: 11 | Journal Article |
Cited by: Papers (50)
Microwave-induced thermal acoustic imaging (TAI) is a promising early breast cancer detection technique, which combines the advantages of microwave stimulation and ultrasound imaging and offers a high imaging contrast, as well as high spatial resolution at the same time. A new multifrequency microwave-induced thermal acoustic imaging scheme for early breast cancer detection is proposed in this pap...Show More

Multifrequency Microwave-Induced Thermal Acoustic Imaging for Breast Cancer Detection

Bin Guo;Jian Li;Henry Zmuda;Mark Sheplak

Year: 2007 | Volume: 54, Issue: 11 | Journal Article |

Piezoresistive Microphone Design Pareto Optimization: Tradeoff Between Sensitivity and Noise Floor

Melih Papila;Raphael T. Haftka;Toshikazu Nishida;Mark Sheplak

Journal of Microelectromechanical Systems
Year: 2006 | Volume: 15, Issue: 6 | Journal Article |
This paper addresses tradeoffs between pressure sensitivity and electronic noise floor in optimizing the performance of a piezoresistive microphone. A design optimization problem is formulated to find the optimum dimensions of the diaphragm, the piezoresistor geometry and location for two objective functions: maximum pressure sensitivity and minimum electronic noise floor. The Pareto curve of opti...Show More

Piezoresistive Microphone Design Pareto Optimization: Tradeoff Between Sensitivity and Noise Floor

Melih Papila;Raphael T. Haftka;Toshikazu Nishida;Mark Sheplak

Year: 2006 | Volume: 15, Issue: 6 | Journal Article |

Surface and bulk micromachined dual back-plate condenser microphone

D.T. Martin;K. Kadirvel;R.M. Fox;T. Nishider;J. Liu;M. Sheplak

18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005.
Year: 2005 | Conference Paper |
Cited by: Papers (8) | Patents (3)
This paper presents the design, fabrication, and characterization of a dual back-plate condenser microphone. The microphone was designed for aeroacoustic applications where a high dynamic range and high bandwidth are key requirements. It was fabricated using the SUMMiT V process at Sandia National Laboratories. The microphone has a 2.25 /spl mu/m thick circular diaphragm with a 230 /spl mu/m radiu...Show More

Surface and bulk micromachined dual back-plate condenser microphone

D.T. Martin;K. Kadirvel;R.M. Fox;T. Nishider;J. Liu;M. Sheplak

Year: 2005 | Conference Paper |

Acoustic proximity ranging in the presence of secondary echoes

Xi Li;Renbiao Wu;S. Rasmi;Jian Li;L.N. Cattafesta;M. Sheplak

IEEE Transactions on Instrumentation and Measurement
Year: 2003 | Volume: 52, Issue: 5 | Journal Article |
Proximity ranging is very important in many applications. Ultrasonic sensors have proven to be very cost effective tools for this purpose. Most of the currently available time-of-flight based acoustic proximity ranging systems use the conventional matched filter based time delay estimation approaches to measure short distances between proximity objects. However, in the presence of strong and close...Show More

Acoustic proximity ranging in the presence of secondary echoes

Xi Li;Renbiao Wu;S. Rasmi;Jian Li;L.N. Cattafesta;M. Sheplak

Year: 2003 | Volume: 52, Issue: 5 | Journal Article |

An analytical model for the thermoelastic actuation of composite diaphragms

V. Chandrasekaran;B.V. Sankar;L.N. Cattafesta;T. Nishida;M. Sheplak

TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)
Year: 2003 | Conference Paper |
Cited by: Papers (2)
An analytical model for the thermoelastic actuation of a circular composite diaphragm is presented. The model incorporates several key aspects relevant to micromachined thermoelastic resonators including multiple material layers, in-plane heat conduction and fabrication-induced stresses. Using a Fourier heat conduction model, expressions for the 2-D temperature distribution in the composite diaphr...Show More

An analytical model for the thermoelastic actuation of composite diaphragms

V. Chandrasekaran;B.V. Sankar;L.N. Cattafesta;T. Nishida;M. Sheplak

Year: 2003 | Volume: 2 | Conference Paper |

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