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Bruce Geil

Also published under: Bruce R. Geil, B. Geil, B. R. Geil

Publications

Citations

219

Publications by Year

20012011

Co-Authors:

A. K. AgarwalS. BalachandranS. BayneRobert CallananC. Capell

Show All Co-Authors (65)

Bruce Geil

Also published under: Bruce R. Geil, B. Geil, B. R. Geil

Affiliation

U.S. Army Research Laboratory

Adelphi

MD, USA

Publication Topics

Aluminum Nitride,
Junction Temperature,
Power Electronics,
Bond Wires,
Coolant,
Device Temperature,
Electronic Packaging,
Heat Sink,
Heat Source,
Pressure Drop,
Silicon Carbide,
Thermal Conductivity

Biography

Bruce R. Geil received the B.S. degree in mechanical engineering from the University of Maryland Baltimore County in 1990. He is currently working toward the M.S. degree in electrical engineering at the University of Maryland, Baltimore.,He has spent 23 years at the Army Research Laboratory (ARL), Adelphi, MD, doing device analysis, fabrication, and packaging in semiconductor electronics and microelectromechanical systems. He is currently leading the team doing research on high-power, high-temperature electronics, specifically in the areas of device analysis, fabrication, and packaging.(Based on document published on 17 September 2007).

Publications

Citations

219

Publications by Year

20012011

Co-Authors:

A. K. Agarwal
S. Balachandran
S. Bayne
Robert Callanan
C. Capell

Show All Co-Authors (65)

Author's Published Works

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The Robotics Institute, Shanghai Jiaotong University, Shanghai, China(1)
Research Institute of Space-power, Shanghai, China(1)
Department of Electronic and Electrical Engineering, Centre for Autonomous Robotics, University of Bath, U.K.(1)
State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, China(1)
AgiBot Technology Company Ltd., Shanghai, China(1)
Fifth World Congress on Intelligent Control and Automation (IEEE Cat. No.04EX788)(1)
IEEE Robotics and Automation Letters(1)
IEEE Transactions on Biomedical Engineering(1)
IEEE(3)
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Reduced-Dimensional Whole-Body Control Based on Model Simplification for Bipedal Robots With Parallel Mechanisms

Yunpeng Liang;Fulong Yin;Zhen Li;Zhilin Xiong;Zhihui Peng;Yanzheng Zhao;Weixin Yan

IEEE Robotics and Automation Letters

Year: 2025 | Volume: 10, Issue: 2 | Journal Article |

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The presence of parallel mechanisms in bipedal robots increases the complexity of modeling and control, making it crucial to manage the trade-off between model accuracy and real-time control. In this letter, we propose a reduced-dimensional whole-body controller for series-parallel bipedal robots, utilizing a floating-base multi-rigid body model with kinematic loops. Notably, we neglect the joint ...Show More

Reduced-Dimensional Whole-Body Control Based on Model Simplification for Bipedal Robots With Parallel Mechanisms

Yunpeng Liang;Fulong Yin;Zhen Li;Zhilin Xiong;Zhihui Peng;Yanzheng Zhao;Weixin Yan

IEEE Robotics and Automation Letters

Year: 2025 | Volume: 10, Issue: 2 | Journal Article |

Online Muscle Activation Onset Detection Using Likelihood of Conditional Heteroskedasticity of Electromyography Signals

Yansong Wang;Nathan Routledge;Yanzheng Zhao;Dingguo Zhang

IEEE Transactions on Biomedical Engineering

Year: 2024 | Volume: 71, Issue: 5 | Journal Article |

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Surface electromyography (sEMG) signals are crucial in developing human-machine interfaces, as they contain rich information about human neuromuscular activities. Objective: The real-time, accurate detection of muscle activation onset (MAO) is significant for EMG-triggered control strategies in embedded applications like prostheses and exoskeletons. Methods: This paper investigates sEMG signals us...Show More

Online Muscle Activation Onset Detection Using Likelihood of Conditional Heteroskedasticity of Electromyography Signals

Yansong Wang;Nathan Routledge;Yanzheng Zhao;Dingguo Zhang

IEEE Transactions on Biomedical Engineering

Year: 2024 | Volume: 71, Issue: 5 | Journal Article |

Adhesive dispensing robot used for the bonding operation of space solar cell

Yanzheng Zhao;Zhuang Fu;Qixin Cao;Mingbo Chen;Jun Zhang;Zeqi Tang

Fifth World Congress on Intelligent Control and Automation (IEEE Cat. No.04EX788)

Year: 2004 | Conference Paper |

To promote the bonding quality and the automatic level of the solar cell assembly, according to the characteristic of the space solar cell bonding operation's process, an adhesive dispensing robot used for the bonding operation is studied in this article. And we put forward a way to continuously dispense adhesives, which can control the thickness of the adhesive layer on solar cell and even the po...Show More

Adhesive dispensing robot used for the bonding operation of space solar cell

Yanzheng Zhao;Zhuang Fu;Qixin Cao;Mingbo Chen;Jun Zhang;Zeqi Tang

Fifth World Congress on Intelligent Control and Automation (IEEE Cat. No.04EX788)

Year: 2004 | Volume: 6 | Conference Paper |

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