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Assembly of Printed Interconnects for Immobilized Protein Microfluidic Assays
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Year: 2023 | Conference Paper |
Microfluidics has attracted significant attention for biological applications, particularly for high-throughput screening and multiplexing. However, conventional interconnect techniques are limited in their ability to fabricate the hundreds or thousands of microfluidic interconnects needed to process multiple samples for high-throughput microfluidics. To address this challenge, coaxial printing wa...Show More
Pillar-Cavity Copper-Copper Bonding for Face-to-Face Carbon Nanotube Synthesis
Hua Xu;Jeffery C.C. Lo;Xing Qiu;Yuanjie Cheng;Mian Tao;S. W. Ricky Lee
2023 IEEE CPMT Symposium Japan (ICSJ)
Year: 2023 | Conference Paper |
The bonding process is a critical step in the synthesis of face-to-face interlaced carbon nanotubes. Copper-copper bonding has emerged as a promising alternative to traditional silicon dioxide to silicon dioxide bonding due to its advantages, including a reduced bonding area requirement and greater flexibility in chip-to-chip bonding. However, the use of formic acid in copper-copper bonding can ad...Show More
Quantum Dot Color Conversion Film with Enhanced Color Rendering Performance
Yuanjie Cheng;Jeffery C. C. Lo;Xing Qiu;Hua Xu;Mian Tao;S. W. Ricky Lee
2023 International Conference on Electronics Packaging (ICEP)
Year: 2023 | Conference Paper |
Cited by: Papers (2)
Quantum dot (QD) color conversion (QDCC) film with monochrome excitation backlight is a promising way to implement mini/micro-LED displays. However, it still faces the challenges of low color conversion efficiency and unsatisfied color gamut owing to insufficient QD concentration in QD-polymer solution. In this paper, we studied the influence of QD surface modification and solvent on the QD-polyme...Show More
A Flexible Thin-Film Inductor for High-Efficiency Wireless Power Transfer
Yuan Yao;Xing Qiu;Yuanjie Cheng;Jeffery C. C. Lo;S. W. Ricky Lee;Wing-Hung Ki;Chi-Ying Tsui
IEEE Electron Device Letters
Cited by: Papers (3)
The design of a thin-film spiral inductor with multi-fin structure on a flexible substrate is proposed that can be used in a fully integrated wireless power transfer (WPT) system. A solid coil with the same dimension and copper thickness but without the multi-fin structure is designed and compared. For the multi-fin coil, the parasitic resistance is reduced from $11.6~\Omega $ to $5.6~\Omega $ ...Show More
Inkjet Printing High Resolution Polydimethylsiloxane Dots Array
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Year: 2022 | Conference Paper |
Cited by: Papers (2)
Inkjet printing polydimethylsiloxane (PDMS) has gain attention in the development of quantum dots light emitting diodes (QLEDs), color conversion layers, microfluid and flexible electronics due to its high transparency, good reflective index value, inflammable, biocompatible and flexile properties. While printing high resolution PDMS dots from dilute PDMS polymer solution is one of the main challe...Show More
A UVC LED Disinfection Closet for Reuse of Protective Coats
Xing Qiu;Jeffery C. C. Lo;Yuanjie Cheng;Hua Xu;Qianwen Xu;S. W. Ricky Lee
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Year: 2022 | Conference Paper |
A closet featured with 1 minute disinfection time was developed for high efficient disinfection of protective coats. An ultraviolet-C light-emitting diode (UVC LED) module with uniform irradiance was developed in a previous study. 56 UVC LED modules were installed in the closet to achieve 99.99% disinfection rate of E. coli, S. aureus and Pseudomonas aeruginosa, 99.9% disinfection rate of H1N1, an...Show More
Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pads Printed by Aerosol Jet
Jeffery C. C. Lo;Qian Jiang;Xing Qiu;Ning Tu;S. W. Ricky Lee
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Year: 2022 | Conference Paper |
Additive manufacturing has been extensively studied as a promising candidate for complete or partial replacement of traditional photolithography methods. The focus of this paper is on redistribution layers (RDLs) fabricated by aerosol jet (AJ) printing. Nanoparticle silver ink was deposited directly on silicon chips to form the conductive layer, while dielectric ink was used for the passivation la...Show More
Solderability Analysis of Inkjet-printed Silver Pads with SAC Solder Joints
2022 International Conference on Electronics Packaging (ICEP)
Year: 2022 | Conference Paper |
Cited by: Papers (3)
Inkjet printing has been studied as one of the potential complements to conventional photolithography for low-cost and rapid prototyping. Different functional inks are directly patterned on the substrate to achieve the desired purpose. In this work, we investigated direct printing of the under-bump metallization (UBM) with a thermally curable particle-free silver ink and the solderability of such ...Show More
Improved Inkjet Printing of Polydimethylsiloxane Droplets
2022 International Conference on Electronics Packaging (ICEP)
Year: 2022 | Conference Paper |
Cited by: Papers (3)
Inkjet printing polydimethylsiloxane (PDMS) has received wide interest in the field of additive manufacturing for printing flexible wearable electronics. Before depositing the PDMS on the target substrate with desired pattern, the PDMS ink must be ejected in a stable manner. One of the problems that affects the jetting quality is the satellite droplet coming with the dominate droplet during the pr...Show More
Synthesis of Face to Face Partially Fused Carbon Nanotubes for the Improvement of Thermal Management in 3D Die Stacking
2021 IEEE 16th Nanotechnology Materials and Devices Conference (NMDC)
Year: 2021 | Conference Paper |
Cited by: Papers (1)
Smaller thermal resistance between stacked chips will help reduce the junction temperature of 3D integrated circuit (3D-IC) under the same operating condition. Carbon Nanotubes (CNTs), as one of the materials with extremely high axial thermal conductivity, are suitable for such an application and compatible with wafer-level processes. However, since CNTs grow from the catalyst and have a free end ...Show More
Evaluation and Reduction of Optical Crosstalk in Quantum Dot Color-Converted Mini/Micro-LED Displays
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
Year: 2021 | Conference Paper |
Cited by: Papers (1)
Quantum dot (QD) color-converted mini/micro-LED displays are considered as the most promising technology for next-generation display with the benefits of high production yield, low cost and good process reproducibility. However, it is still facing the challenge of optical crosstalk among adjacent subpixels, which degrades the display resolution and worsens the color rendering. To reduce the optica...Show More
Realizing Low Optical Crosstalk, Wide Color Gamut Mini-LED Displays via Laser-Patterned Quantum Dots Color Conversion Layer
2021 International Conference on Electronics Packaging (ICEP)
Year: 2021 | Conference Paper |
Cited by: Papers (2)
Laser patterning of quantum dots color conversion (QDCC) layer has proven technically feasible to be implemented in full-color mini/micro-LED displays. However, the laser-patterned QDCC layer is still facing the challenges of optical crosstalk and unsaturated excited colors. In this paper, we report on the improved design and fabrication process of QDCC layer to achieve low optical crosstalk, wide...Show More
Cross-sectioning Technique for Bonded Silicon Substrates with Face-to-Face Interlaced Carbon Nanotubes in Microchannels
2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Year: 2020 | Conference Paper |
Cited by: Papers (2)
Cross-sectioning plays an important role in failure analysis. However, commonly used polishing method affects the bonded silicon microchannels and face-to-face interlaced carbon nanotubes (CNTs). Polishing damages the edge of the microchannels and the debris from polishing may be trapped in the microchannels. This paper proposes a novel cross-sectioning technique to realize precise cross-sectionin...Show More
UV LED Assisted Printing Platform for Fabrication of Micro-Scale Polymer Pillars
Xing Qiu;Jeffery C. C. Lo;Yuanjie Cheng;S. W. Ricky Lee;Yong Jhe Tseng;Hung Kuan Yi;Peter Chiu
Ultraviolet (UV) assisted printing has emerged as a promising additive manufacturing (AM) technology, which puts UV light sources with focused emission in high demand. Unfortunately, current ultraviolet light-emitting diodes (UV LEDs) are not able to provide adequately focused UV emission required for printing. Thus, a UV LED package with focused UV emission was proposed and fabricated using micro...Show More
Quantum Dot Film Patterning on a Trenched Glass Substrate for Defining Pixel Arrays of a Full-color Mini/Micro-LED Display
Yuanjie Cheng;Jeffery C. C. Lo;Xing Qiu;Brian Shieh;S. W. Ricky Lee
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
Year: 2020 | Conference Paper |
Cited by: Papers (3)
The major hurdle to the implementation of full-color mini/micro-LED display is the mass transfer of red-green-blue (RGB) LED chips, which leads to low yield and high cost of full-color mini/micro-LED display. To overcome this issue, an alternative emitting source of quantum dot (QD) color conversion film with monolithic excitation backlight is a feasible solution. This paper proposes an innovative...Show More
Printing Unifrom QDs Polymer Thin Film for QLED Applications
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
Year: 2020 | Conference Paper |
Cited by: Papers (2)
The inkjet printing method is a promising deposition method to fabricate multicolor quantum dot display, multicolor micro-LED display, and solar cells. This paper presents a method to inkjet print uniform quantum dots (QDs) polymer films for multicolor QLED display applications. The challenge is to obtain uniform polymer QDs dots from the dilute polymer solution without affecting the optical prope...Show More
Long-term Stability Evaluation of Thermal Interface Materials (TIMs)
Jeffery C. C. Lo;Mian Tao;Yuanjie Cheng;Qianwen Xu;Kunhui Xiao;S. W. Ricky Lee
2019 20th International Conference on Electronic Packaging Technology(ICEPT)
Year: 2019 | Conference Paper |
Cited by: Papers (4)
Thermal interface materials (TIMs) play an important role in thermal management of high-performance microprocessors. Thermal resistance of TIM dominates in the overall thermal dissipation path. It is necessary to provide an effective and reliable thermal dissipation path to dissipate a large amount of heat generated by the IC in order to maintain a low operating junction temperature. The objective...Show More
Investigation of Processing Parameters for the Fabrication of Microfluidic Connectors Using a UV-assisted Coaxial 3D Printing System
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
Year: 2019 | Conference Paper |
Effective and reliable world-to-chip interface is one significant requirement for microfluidics. A simple, rapid with wide applicability approach for fabricating microfluidic connectors has been proposed using a UV-assisted coaxial 3D printing system. An assembled coaxial nozzle and a focused UV LED light source were designed to enable the process. This paper systematically investigates the proces...Show More
Feasibility Study of Fan-Out Panel-Level Packaging for Heterogeneous Integrations
Cheng-Ta Ko;Henry Yang;John H. Lau;Ming Li;Curry Lin;Chieh-Lin Chang;Jhih-Yuan Pan;Hsing-Hui Wu;Iris Xu;Tony Chen;Zhang Li;Kim Hwee Tan;Penny Lo;R. So;Y. H. Chen;Nelson Fan;Eric Kuah;Marc Lin;Y. M. Cheung;Eric Ng;Cao Xi;Rozalia Beica;Sze Pei Lim;N. C. Lee;Mian Tao;Jeffery Lo;Ricky Lee
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
Year: 2019 | Conference Paper |
Cited by: Papers (2)
The design, materials, process, and fabrication of a heterogeneous integration of 4 chips by a FOPLP (fan-out panel-level packaging) with chip-first and dies face-down formation are investigated in this study. Emphasis is placed on the application of a new assembly process and materials for fabricating the RDLs (redistribution layers) of the FOPLP. The panel size is 508mm x 508mm. The epoxy moldin...Show More
Feasibility Study of Fan-Out Panel-Level Packaging for Heterogeneous Integrations
Cheng-Ta Ko;Henry Yang;John H. Lau;Ming Li;Curry Lin;Chieh-Lin Chang;Jhih-Yuan Pan;Hsing-Hui Wu;Iris Xu;Tony Chen;Zhang Li;Kim Hwee Tan;Penny Lo;R. So;Y. H. Chen;Nelson Fan;Eric Kuah;Marc Lin;Y. M. Cheung;Eric Ng;Cao Xi;Rozalia Beica;Sze Pei Lim;N. C. Lee;Mian Tao;Jeffery Lo;Ricky Lee
Year: 2019 | Conference Paper |
Feasibility Study of Fan-Out Wafer-Level Packaging for Heterogeneous Integrations
John Lau;Ming Li;Iris Xu;Tony Chen;Kim Hwee Tan;Zhang Li;Nelson Fan;Eric Kuah;Raymond So;Penny Lo;Y. M. Cheung;Cao Xi;Rozalia Beica;Sze Pei Lim;N.C. Lee;Cheng-Ta Ko;Henry Yang;Y.H. Chen;Mian Tao;Jeffery Lo;Ricky Lee
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
Year: 2019 | Conference Paper |
Cited by: Papers (4)
The design, materials, process, and fabrication of a heterogeneous integration of 4 chips by a FOWLP (fan-out wafer-level packaging) with chip-first and dies face-down method are investigated in this study. Emphasis is placed on the application of a new assembly process and materials for fabricating the RDLs (redistribution layers) of the heterogeneous integration. The size of the reconstituted wa...Show More
Feasibility Study of Fan-Out Wafer-Level Packaging for Heterogeneous Integrations
John Lau;Ming Li;Iris Xu;Tony Chen;Kim Hwee Tan;Zhang Li;Nelson Fan;Eric Kuah;Raymond So;Penny Lo;Y. M. Cheung;Cao Xi;Rozalia Beica;Sze Pei Lim;N.C. Lee;Cheng-Ta Ko;Henry Yang;Y.H. Chen;Mian Tao;Jeffery Lo;Ricky Lee
Year: 2019 | Conference Paper |
Evaluation and Benchmarking of Cu Pillar Micro-bumps with Printed Polymer Core
Xing QIU;Jeffery C. C. LO;S. W. Ricky LEE;Ying-Hong LIOU;Peter CHIU
2019 International Conference on Electronics Packaging (ICEP)
Year: 2019 | Conference Paper |
Cited by: Papers (7)
Cu pillar micro-bumps are the enabling technology for high-density fine-pitch interconnection in flip-chip die stacking and 3D IC integration. Due to the significant mismatch in coefficient of thermal expansion (CTE) between the silicon chip and organic substrate or the printed circuit board (PCB), the rigid joints made of pure Cu pillars may suffer rather high thermomechanical stress during reflo...Show More
The Effect of Metallic Interconnect Spacing on the Thermal Resistance of Flip-Chip Light-Emitting Diodes With Underfill Encapsulation
While highly thermally conductive underfill material has been proposed as a solution for reducing the thermal resistance of flip-chip light-emitting diode (FCLED) packages, studies up until this point have not taken into account the layout of the underlying metallic interconnects and its impact on thermal resistance. This paper provides a deeper investigation into how interconnect spacing affects ...Show More
Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes
Light-emitting diode (LED) devices depend strongly on proper thermal management to mitigate negative effects caused by high operating temperature, especially in general lighting applications. Flip-chip packaging has been used as a solution to reduce thermal resistance, with some iterations involving an epoxy underfill material to mechanically support solder joints and assist in thermal management....Show More
Thermal Simulation for High Power LED Systems with Remote Phosphor Layer
Minshu Zhang;An Xie;Jeffery C. C. Lo;S. W. Ricky Lee;Madina. Ahmatjan;Feichi Hong;Haotian Yin
2018 20th International Conference on Electronic Materials and Packaging (EMAP)
Year: 2018 | Conference Paper |
A lot of high power LED products adopt remote phosphor instead of conformal phosphor, since remote phosphor design can increase the light output and decrease the manufacture cost. However, whether the new design will affect the thermal performance is still not very clear. Thus, this paper is focus on the thermal performance of high power LED systems. The numerical models are built based on the rea...Show More
Additive Manufacturing of Micro-channels on a Silicon Substrate based on Coaxial Printing Dispenser with in-situ UV LED Curing
2018 20th International Conference on Electronic Materials and Packaging (EMAP)
Year: 2018 | Conference Paper |
Micro-channels in MEMS can provide passage to liquid or gas for various applications. Conventional fabrication of micro-channels is by silicon etching or soft lithography. This paper proposes an alternative approach for fabricating micro-channels on a silicon or glass substrate based on coaxial printing by a needle dispenser with UV-LED for in-situ curing. In the present research, the coaxial nozz...Show More
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