Isao Tamai - IEEE Xplore Author Profile
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Isao Tamai

Also published under: I. Tamai

Publications
10
Citations
52
Publications by Year
20192023
Co-Authors:
Show All Co-Authors (19)
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Isao Tamai

Also published under: I. Tamai

Affiliation

Oki Electric Industry Company Ltd., Tokyo, Japan

Publication Topics

Biography

Isao Tamai received the Ph.D. degree from Hokkaido University, Sapporo, Japan, in 2006. He joined the Corporate R&D Center of OKI Electric Industry Co., Ltd. in 2006. Since then, he has been engaged in the development of optical components. His current research interests include the design and characterization of integrated silicon photonics devices.(Based on document published on 20 May 2020).
Publications
10
Citations
52
Publications by Year
20192023
Co-Authors:
Show All Co-Authors (19)
Author's Published Works

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Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

Akihiro Noriki;Akio Ukita;Koichi Takemura;Satoshi Suda;Takayuki Kurosu;Yasuhiro Ibusuki;Isao Tamai;Daisuke Shimura;Yosuke Onawa;Hiroki Yaegashi;Takeru Amano

Journal of Lightwave Technology
Year: 2023 | Volume: 41, Issue: 15 | Journal Article |
Cited by: Papers (5)
To realize a new package substrate for co-packaged optics, a silicon-photonics hybrid glass-epoxy substrate was demonstrated. In the substrate, silicon photonics dies working as optical/electrical conversion engines are embedded. Additionally, it includes optical redistribution composed of polymer waveguides and mirror-based optical coupling structures between the polymer and silicon waveguides. A...Show More

Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

Akihiro Noriki;Akio Ukita;Koichi Takemura;Satoshi Suda;Takayuki Kurosu;Yasuhiro Ibusuki;Isao Tamai;Daisuke Shimura;Yosuke Onawa;Hiroki Yaegashi;Takeru Amano

Year: 2023 | Volume: 41, Issue: 15 | Journal Article |

Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

A. Noriki;A. Ukita;K. Takemura;S. Suda;T Kurosu;Y. Ibusuki;I. Tamai;D. Shimura;Y. Onawa;H. Yaegashi;T. Amano

2022 European Conference on Optical Communication (ECOC)
Year: 2022 | Conference Paper |
Cited by: Papers (1)
To realize a new package substrate for co-packaged optics, silicon-photonics hybrid glass-epoxy substrate with optical redistribution layer was demonstrated. 112 Gbps PAM-4 transmissions through the hybrid substrate were demonstrated with the TDECQ less than 3.4 dB.Show More

Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

A. Noriki;A. Ukita;K. Takemura;S. Suda;T Kurosu;Y. Ibusuki;I. Tamai;D. Shimura;Y. Onawa;H. Yaegashi;T. Amano

Year: 2022 | Conference Paper |

Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics

Akihiro Noriki;Isao Tamai;Yasuhiro Ibusuki;Akio Ukita;Satoshi Suda;Koichi Takemura;Daisuke Shimura;Yosuke Onawa;Hiroki Yaegashi;Takeru Amano

IEEE Photonics Technology Letters
Year: 2022 | Volume: 34, Issue: 17 | Journal Article |
Cited by: Papers (10)
We previously proposed a new package substrate called active optical package (AOP) substrate to realize co-packaged optics. An optical redistribution technology on silicon photonics dies was developed to fabricate the AOP substrate. It is composed of a polymer waveguide, with a mirror-based optical coupling between the polymer and silicon waveguides. The fabricated optical redistribution loss was ...Show More

Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics

Akihiro Noriki;Isao Tamai;Yasuhiro Ibusuki;Akio Ukita;Satoshi Suda;Koichi Takemura;Daisuke Shimura;Yosuke Onawa;Hiroki Yaegashi;Takeru Amano

Year: 2022 | Volume: 34, Issue: 17 | Journal Article |

Heat-tolerant 112-Gb/s PAM4 transmission using active optical package substrate for silicon photonics co-packaging

S. Suda;T. Kurosu;A. Noriki;I. Tamai;Y. Ibusuki;A. Ukita;K. Takemura;D. Shimura;Y. Onawa;H. Yaegashi;T. Aoki;T. Amano

2021 Opto-Electronics and Communications Conference (OECC)
Year: 2021 | Conference Paper |
Cited by: Papers (2)
We demonstrate temperature insensitive operation of an active optical package substrate comprising of silicon waveguide, two micro-mirrors and polymer waveguide. Transmission of 112-Gb/s PAM4 optical signal was performed without noticeable penalty at 85 °C.Show More

Heat-tolerant 112-Gb/s PAM4 transmission using active optical package substrate for silicon photonics co-packaging

S. Suda;T. Kurosu;A. Noriki;I. Tamai;Y. Ibusuki;A. Ukita;K. Takemura;D. Shimura;Y. Onawa;H. Yaegashi;T. Aoki;T. Amano

Year: 2021 | Conference Paper |

Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate

T. Amano;A. Noriki;I. Tamai;Y. Ibusuki;A. Ukita;S. Suda;T. Kurosu;K. Takemura;T. Aoki;D. Shimura;Y. Onawa;H. Yaegashi

2021 Optical Fiber Communications Conference and Exhibition (OFC)
Year: 2021 | Conference Paper |
We propose a next generation co-packaged substrate using Si photonics dies, a polymer optical waveguide, and a optical connector to achieve beyond 10 Tb/s and WDM optical links. The two micro-mirrors and polymer waveguides were integrated, and their optical characteristics were evaluated.Show More

Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate

T. Amano;A. Noriki;I. Tamai;Y. Ibusuki;A. Ukita;S. Suda;T. Kurosu;K. Takemura;T. Aoki;D. Shimura;Y. Onawa;H. Yaegashi

Year: 2021 | Conference Paper |

Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors

A. Noriki;I. Tamai;Y. Ibusuki;A. Ukita;S. Suda;K. Takemura;D. Shimura;Y. Onawa;H. Yaegashi;T. Amano

2020 European Conference on Optical Communications (ECOC)
Year: 2020 | Conference Paper |
Cited by: Papers (11)
An optical re-distribution based on micro-mirrors and polymer waveguide was demonstrated on a silicon photonics die for advanced co-packaged optics. Low wavelength dependent characteristics was obtained and 28GBaud NRZ signal was also successfully transmitted with negligible signal distortions.Show More

Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors

A. Noriki;I. Tamai;Y. Ibusuki;A. Ukita;S. Suda;K. Takemura;D. Shimura;Y. Onawa;H. Yaegashi;T. Amano

Year: 2020 | Conference Paper |

Mirror-Based Broadband Silicon-Photonics Vertical I/O With Coupling Efficiency Enhancement for Standard Single-Mode Fiber

Akihiro Noriki;Isao Tamai;Yasuhiro Ibusuki;Akio Ukita;Satoshi Suda;Daisuke Shimura;Yosuke Onawa;Hiroki Yaegashi;Takeru Amano

Journal of Lightwave Technology
Year: 2020 | Volume: 38, Issue: 12 | Journal Article |
Cited by: Papers (19)
The broadband vertical optical coupling of silicon (Si) photonics poses significant challenges regarding the use of wavelength division multiplexing (WDM). The grating coupler, a type of vertical optical coupling device, strongly depends on the wavelength. As an alternative, we developed another vertical optical coupling device using a 45° curved micro-mirror. To experimentally demonstrate the bro...Show More

Mirror-Based Broadband Silicon-Photonics Vertical I/O With Coupling Efficiency Enhancement for Standard Single-Mode Fiber

Akihiro Noriki;Isao Tamai;Yasuhiro Ibusuki;Akio Ukita;Satoshi Suda;Daisuke Shimura;Yosuke Onawa;Hiroki Yaegashi;Takeru Amano

Year: 2020 | Volume: 38, Issue: 12 | Journal Article |

Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror

Akihiro Noriki;Isao Tamai;Yasuhiro Ibusuki;Akio Ukita;Satoshi Suda;Daisuke Shimura;Yosuke Onawa;Hiroki Yaegashi;Takeru Amano

2019 International 3D Systems Integration Conference (3DIC)
Year: 2019 | Conference Paper |
Cited by: Papers (1)
Optical through Si vias (TSVs) for Si photonics have been studied for many new applications and grating couplers have been used as vertical optical I/O (input/output) devices. Recently, we demonstrated a new vertical optical I/O using an integrated curved micro-mirror. Compared to grating couplers, broadband optical I/O can be available. In this work, a feasibility study of an optical TSV using th...Show More

Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror

Akihiro Noriki;Isao Tamai;Yasuhiro Ibusuki;Akio Ukita;Satoshi Suda;Daisuke Shimura;Yosuke Onawa;Hiroki Yaegashi;Takeru Amano

Year: 2019 | Conference Paper |

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