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Chengjun Liang - IEEE Xplore Author Profile

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Author details

Chengjun Liang

Publications

6

Citations

13

Publications by Year

20182023

Co-Authors:

Ming ChenXing FanYanpeng HaoZebin HeRan Hu

Show All Co-Authors (22)

Chengjun Liang

Affiliation

Guangzhou Power Supply Bureau

Guangdong Power Grid Co.

Ltd., CSG, Guangzhou, China

Publication Topics

Electric Field Distribution,
Electric Distribution,
Electric Field Strength,
Dielectric Surface,
Maximum Field,
SF6 Gas,
Space Charge,
Discharge Channel,
Finite Element Method,
Maximum Electric Field,
Normal Component,
Surface Flashover

Biography

Chengjun Liang was born in Chongqing, China, in 1995. He received the B.S. and M.S. degrees in electrical engineering from Xi’an Jiaotong University, Xi’an, China, in 2018 and 2021, respectively.,He is currently an Assistant Engineer with Guangzhou Power Supply Bureau Company, Ltd., Guangdong Power Grid Company Ltd., Guangzhou, China. His major research interests include electrical insulation properties of high-voltage power transmission and transformation bbreak equipment.(Based on document published on 17 May 2023).

Publications

6

Citations

13

Publications by Year

20182023

Co-Authors:

Ming Chen
Xing Fan
Yanpeng Hao
Zebin He
Ran Hu

Show All Co-Authors (22)

Author's Published Works

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Showing 1-6 of 6 results

Conferences (4)

Journals (2)

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Single Year
Chengjun Liang(4)
Qiaogen Zhang(3)
Xiaoang LI(2)
Ming Chen(2)
Xuandong Liu(2)
Key Laboratory of Electrical Insulation and Power Equipment, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China(1)
China Electric Power Research Institute, Beijing, P.R.China(1)
School of Electric Power Engineering, South China University of Technology, Guangzhou, China(1)
State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China(1)
Guangzhou Power Supply Bureau, Guangdong Power Grid Co., Ltd., CSG, Guangzhou, China(1)
2018 Condition Monitoring and Diagnosis (CMD)(1)
2018 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)(1)
2020 IEEE Electrical Insulation Conference (EIC)(1)
2023 IEEE 6th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE)(1)
IEEE Access(1)
IEEE(6)
Cancun, Mexico(1)
Knoxville, TN, USA(1)
Perth, WA, Australia(1)
Shenyang, China(1)
Electric Field Distribution(5)
Electric Distribution(4)
Electric Field Strength(4)
Dielectric Surface(3)
Maximum Field(3)

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Method of Data Transmission Technology Based on Fiber Optic Sensing Vibration

Yunxun Liu;Qiushi Meng;Zebin He;Ran Hu;Chengjun Liang;Tinghan Song;Xing Huang

2023 IEEE 6th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE)

Year: 2023 | Conference Paper |

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This article constructed a fiber optic distributed vibration sensing system based on FPGA (Field Programmable Gate Array). The FPGA chip was proposed to collect, preprocess, demodulate, and transmit vibration signals, fully leveraging the parallel computing advantages of FPGA, improving the data processing speed and real-time response, and thereby reducing the data processing burden on personal co...Show More

Method of Data Transmission Technology Based on Fiber Optic Sensing Vibration

Yunxun Liu;Qiushi Meng;Zebin He;Ran Hu;Chengjun Liang;Tinghan Song;Xing Huang

2023 IEEE 6th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE)

Year: 2023 | Conference Paper |

Discharge Randomness and Attraction Process of Epoxy Surface on Discharge Channel in SF6 Gas Under Uniform Electric Field

Lin Liu;Yanpeng Hao;Qiaogen Zhang;Chengjun Liang;Licheng Li

IEEE Transactions on Dielectrics and Electrical Insulation

Year: 2023 | Volume: 30, Issue: 5 | Journal Article |

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It is generally believed that due to the electric field distortion effect and the photoemission process of the solid surface, the discharge channel near the solid surface tends to develop along the surface than that in bulk gas. One way to improve insulation performance is to avoid the solid surface from participating in the gas discharge process. However, the mechanism of the solid surface’s effe...Show More

Discharge Randomness and Attraction Process of Epoxy Surface on Discharge Channel in SF6 Gas Under Uniform Electric Field

Lin Liu;Yanpeng Hao;Qiaogen Zhang;Chengjun Liang;Licheng Li

IEEE Transactions on Dielectrics and Electrical Insulation

Year: 2023 | Volume: 30, Issue: 5 | Journal Article |

Application of Heat Pipe Technology on Averaging Temperature of UHV Converter Valve-Side Bushing

Ming Chen;Xuandong Liu;Xing Fan;Qiaogen Zhang;Chengjun Liang;Yi Zhao

2020 IEEE Electrical Insulation Conference (EIC)

Year: 2020 | Conference Paper |

Cited by: Papers (1)

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As a critical component of UHV converter transformer, the converter valve-side bushing plays a vital role in connecting HVAC and HVDC systems. Due to the poor radial heat dissipation of the UHV converter valve-side bushing, the overall temperature and electric field distribution are incredibly uneven, especially under the condition of high ambient temperature and heavy load. To improve the tempera...Show More

Application of Heat Pipe Technology on Averaging Temperature of UHV Converter Valve-Side Bushing

Ming Chen;Xuandong Liu;Xing Fan;Qiaogen Zhang;Chengjun Liang;Yi Zhao

2020 IEEE Electrical Insulation Conference (EIC)

Year: 2020 | Conference Paper |

XJTU: Typical Arrangements for Downstream Uniformity Assessment in Atmospheric-Pressure Plasma Jet Arrays

Qiang Ren;Xuandong Liu;Hao Sun;Chengwei Huang;Feiyan Zhou;Ming Chen;Chengjun Liang

Year: 2020 | Volume: 8 | Journal Article |

Cited by: Papers (4)

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The downstream uniformity of the atmospheric-pressure plasma jet array is a key technical problem in regards to large-scale applications. This paper presents a 2-D array device of five jets arranged in four different shapes designed from the perspective of symmetry. Various schemes were tested to determine the effects of jet arrangement on the downstream uniformity of the array: the completely sym...Show More

XJTU: Typical Arrangements for Downstream Uniformity Assessment in Atmospheric-Pressure Plasma Jet Arrays

Qiang Ren;Xuandong Liu;Hao Sun;Chengwei Huang;Feiyan Zhou;Ming Chen;Chengjun Liang

Year: 2020 | Volume: 8 | Journal Article |

The Influence of Electric Field Distribution on Insulator Surface Flashover

Lin LIU;Xiaoang LI;Qiaogen ZHANG;Chengjun LIANG;Haiyang REN;Junping Zhao;Zhibing LI

2018 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)

Year: 2018 | Conference Paper |

Cited by: Papers (5)

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Insulator surface flashover is one of the main causations for the gas insulated metal enclosed switchgear (GIS) devices failure. The local electric field enhancement is the intrinsic reason for the surface discharge. To clarify the relationship between insulator surface flashover and its surface electric field distribution, we manufactured insulator samples with various shapes and embedded electro...Show More

The Influence of Electric Field Distribution on Insulator Surface Flashover

Lin LIU;Xiaoang LI;Qiaogen ZHANG;Chengjun LIANG;Haiyang REN;Junping Zhao;Zhibing LI

2018 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)

Year: 2018 | Conference Paper |

Surface Flashover of GIS Insulator Attached with Metal Particles Under Lightning Impulse

Lin LIU;Xiaoang LI;Qiaogen Zhang;Junping ZHAO;Chengjun LIANG;Zhibing LI

2018 Condition Monitoring and Diagnosis (CMD)

Year: 2018 | Conference Paper |

Cited by: Papers (3)

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Insulator surface flashover is one of the main causations for the gas insulated metal enclosed switchgear (GIS) devices failure. According to the previous studies, the metal particles plays an important role in the flashover of insulators, and the flashover voltage decreases more under impulse voltage than AC/DC voltage. As a result, the lightning impulse voltage is regarded as an effective way to...Show More

Surface Flashover of GIS Insulator Attached with Metal Particles Under Lightning Impulse

Lin LIU;Xiaoang LI;Qiaogen Zhang;Junping ZHAO;Chengjun LIANG;Zhibing LI

2018 Condition Monitoring and Diagnosis (CMD)

Year: 2018 | Conference Paper |

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