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A Sensitivity Study of Butler Matrices: Application to an SIW Extended Beam Matrix at 28 GHz
Giuseppe Acri;Jordan Corsi;Florence Podevin;Emmanuel Pistono;Philippe Ferrari;Luigi Boccia
In this paper, a detailed sensitivity study of Butler matrices is proposed. In particular, a Monte Carlo analysis is carried out on each block constituting the matrix to estimate its impact on the overall performance. The isolation level of the crossover transmission path is hence proved to be a critical part of the Butler matrix design. As it will be shown using both full-wave analysis and analyt...Show More
A Millimeter-Wave Substrate Integrated Waveguide Filter in Si-BCB Technology
Jordan Corsi;Giuseppe Acri;Maxime Moulin;Nicolas Zerounian;Anne-Sophie Grimault-Jacquin;Loïc Vincent;Guillaume Ducournau;Frédéric Aniel;Florence Podevin;Philippe Ferrari;Emmanuel Pistono
In this paper the design, measurements and retro-simulations of a 110-GHz 5th-order Chebyshev filter, based on substrate integrated waveguide in a $30-\mu\mathrm{m}$ thick BenzoCycloButene (BCB) above-IC technology, are presented. A center frequency of 101.5 GHz, corresponding to a 8.5-GHz frequency shift towards low frequencies, and 11.8% of fractional bandwidth are measured. The filter presents ...Show More
BenzoCycloButene-based in-Package Substrate Integrated Waveguides for sub-THz Applications
G. Acri;E. Pistono;F. Podevin;P. Ferrari;L. Boccia;A.-S. Grimault-Jacquin;N. Zerounian;F. Aniel;L. Vincent
This paper introduces an experimental characterization of substrate integrated waveguide (SIW) components integrated in a benzocyclobutene-based interposer for WR10-band applications. High performance SIWs were experimentally validated, with a measured attenuation constant of 0.39 dB/mm and a quality factor of 27 at 90 GHz. The attenuation constant remains equal to 0.4 dB/mm between 85 GHz and 110...Show More
Compact and performing transmission lines for mm-wave circuits design in advanced CMOS technology
Giuseppe Acri;Luigi Boccia;N. Corrao;Florence Podevin;Emmanuel Pistono;T. Lim;E. N. Isa;Philippe Ferrari
2019 14th European Microwave Integrated Circuits Conference (EuMIC)
Year: 2019 | Conference Paper |
Cited by: Papers (1)
This work presents a comparative study of conventional and slow wave (SW) transmission lines implemented in an advanced 22-nm CMOS process. Both microstrip (MS) and coplanar waveguides (CPW) were analysed through simulations and measurements. A classical SW approach was used for the implementation of the SW CPWs while the SW effect was generated in the MS lines using bed of nails integrated in the...Show More
A Millimeter-Wave Miniature Branch-Line Coupler in 22-nm CMOS Technology
G. Acri;F. Podevin;E. Pistono;L. Boccia;N. Corrao;T. Lim;E. N. Isa;P. Ferrari
IEEE Solid-State Circuits Letters
Cited by: Papers (12)
A 60-GHz innovative quadrature branch-line coupler is proposed in this letter. The device was implemented in a 22-nm CMOS process, from global foundries. The proposed design merges two miniaturization techniques. On the one hand, slow-wave microstrip (SW-MS) lines based on bed of nails are demonstrated in CMOS technology for the first time. On the other hand, the two quarter-wavelength MS line sec...Show More
Design Optimization of Through-Silicon Vias for Substrate-Integrated Waveguides embedded in High-Resistive Silicon Interposer
M. Wietstruck;S. Marschmeyer;S. Tolunay Wipf;C. Wipf;T. VoΒ;M. Bertrand;E. Pistono;G. Acri;F. Podevin;P. Ferrari;M. Kaynak
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
Year: 2018 | Conference Paper |
Cited by: Papers (2)
In this work, the optimization of TSVs for SIWs embedded in a high-resistive silicon interposer is demonstrated. EM simulations are performed to analyze and optimize important TSV design parameters enabling silicon interposer technologies with low-loss SIWs working at mm-wave/THz frequencies. A silicon interposer using high resistive silicon and TSVs is fabricated and SIWs are characterized workin...Show More
Substrate Integrated Waveguides for mm-wave Functionalized Silicon Interposer
Matthieu Bertrand;Emmanuel Pistono;Giuseppe Acri;Darine Kaddour;Florence Podevin;Vincent Puyal;Selin Tolunay Wipf;Christian Wipf;Matthias Wietstruck;Mehmet Kaynak;Philippe Ferrari
2018 IEEE/MTT-S International Microwave Symposium - IMS
Year: 2018 | Conference Paper |
Cited by: Papers (23)
This paper presents D-band mm-wave SIWs, which are embedded in a high-resistivity silicon interposer. Thanks to the interposer thickness equal to 70 μm, high-performance SIW were obtained, with measured attenuation constant between 0.4 and 0.6 dB/mm from 110 GHz to 170 GHz. These first results pave the way for the realization of high performance passive circuits and antennas embedded in the interp...Show More
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