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1992 Proceedings 42nd Electronic Components & Technology Conference(1)
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A thin film multichip module for workstation applications

M.F. Bregman;A. Kimura;T. Matsui;H. Nishida;K. Nishiyama;H. Ohkuma;A. Tanaka;C. Kovac;D. McQueeney

1992 Proceedings 42nd Electronic Components & Technology Conference

Year: 1992 | Conference Paper |

Cited by: Papers (9)

A thin film multichip module which utilizes very high density wiring on a silicon substrate has been developed. The technology has been demonstrated using the IBM RISC (reduced instruction set computer) System/6000 processor as a vehicle. The prototype module contains a RISC processor consisting of nine CMOS VLSI chips. The package also contains decoupling capacitors and has 684 I/O. The substrate...Show More

A thin film multichip module for workstation applications

M.F. Bregman;A. Kimura;T. Matsui;H. Nishida;K. Nishiyama;H. Ohkuma;A. Tanaka;C. Kovac;D. McQueeney

1992 Proceedings 42nd Electronic Components & Technology Conference

Year: 1992 | Conference Paper |

Chemistry at interfaces: Electropositive metals on polymer surfaces

C. A. Kovac;J. L. Jordan-Sweet;M. J. Goldberg;J. G. Clabes;A. Viehbeck;R. A. Pollak

IBM Journal of Research and Development

Year: 1988 | Volume: 32, Issue: 5 | Journal Article |

Cited by: Papers (25)

This paper presents a study of chemical interactions between polymer surfaces and metal atoms deposited from the vapor phase. Such interactions may play an important role in interfacial metal-polymer adhesion. The chemical nature of the interface formed when an electropositive metal (chromium or cesium) is deposited onto the surface of PMDA-ODA polyimide has been investigated using chemical model ...Show More

Chemistry at interfaces: Electropositive metals on polymer surfaces

C. A. Kovac;J. L. Jordan-Sweet;M. J. Goldberg;J. G. Clabes;A. Viehbeck;R. A. Pollak

IBM Journal of Research and Development

Year: 1988 | Volume: 32, Issue: 5 | Journal Article |

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