Scheduled Maintenance on Monday 1/13/2025

Single article sales and account management will be unavailable from 5:00 AM - 7:00 PM ET (09:00 - 23:00 UTC). We apologize for the inconvenience.

IEEE.org
IEEE Xplore
IEEE SA
IEEE Spectrum
More Sites

- Donate
- Personal Sign In

Institutional Sign In

ADVANCED SEARCH

Author details

< Back

Wencong Tu

Publications

Citations

198

Publications by Year

20132024

Co-Authors:

Zhe ChenYi ChengLongran CuiXueli FangPeng He

Show All Co-Authors (16)

Wencong Tu

Affiliation

Shaanxi Aero Electric Company Ltd., Xi’an, China

Publication Topics

Load Torque,
Permanent Magnet Synchronous Motor,
Cost Function,
Dynamic Performance,
Extended State Observer,
Model Predictive Control,
Predictive Control,
Simulation Results,
Speed Control,
Active Disturbance Rejection Control,
Actuation System,
Discrete Domain

Biography

Wencong Tu was born in Shaanxi, China, in 1988. He received the B.S. and M.S. degrees in electrical engineering from the Automation Faculty, Northwestern Polytechnical University (NPU), Xi’an, China, in 2011 and 2014, respectively. Since 2013, he has been working toward the Ph.D. degree in electrical engineering at NPU.,His research interests include predictive control for power electronics and electric drives, real-time simulation technology for electrical drive systems, and application of FPGA-based digital controllers.(Based on document published on 13 June 2016).

Publications

Citations

198

Publications by Year

20132024

Co-Authors:

Zhe Chen
Yi Cheng
Longran Cui
Xueli Fang
Peng He

Show All Co-Authors (16)

Author's Published Works

Search History

Showing 1-2 of 2 results

Conferences (1)

Journals (1)

Sort

Filter Results

Show

All Results

Open Access Only

Range
Single Year
D. McQueeney(1)
C. A. Kovac(1)
A. Viehbeck(1)
M. J. Goldberg(1)
A. Tanaka(1)
IBM Research Division, T.J. Watson Research Center, Yorktown Heights, NY(1)
IBM Thomas J. Watson Research Center, Yorktown Heights, NY, USA(1)
IBM Japan Ltd., Shiga, Japan(1)
Yasu Technology Applications Laboratory, IBM Japan Limited, Yasu, Shiga, Japan(1)
1992 Proceedings 42nd Electronic Components & Technology Conference(1)
IBM Journal of Research and Development(1)
IBM(1)
IEEE(1)
San Diego, CA, USA(1)
Thin Films(2)
Appearance Of Peak(1)
Assembly Process(1)
Auger Electron Spectroscopy(1)
Binding Energy(1)

Select All on Page

Sort By

Results

A thin film multichip module for workstation applications

M.F. Bregman;A. Kimura;T. Matsui;H. Nishida;K. Nishiyama;H. Ohkuma;A. Tanaka;C. Kovac;D. McQueeney

1992 Proceedings 42nd Electronic Components & Technology Conference

Year: 1992 | Conference Paper |

Cited by: Papers (9)

A thin film multichip module which utilizes very high density wiring on a silicon substrate has been developed. The technology has been demonstrated using the IBM RISC (reduced instruction set computer) System/6000 processor as a vehicle. The prototype module contains a RISC processor consisting of nine CMOS VLSI chips. The package also contains decoupling capacitors and has 684 I/O. The substrate...Show More

A thin film multichip module for workstation applications

M.F. Bregman;A. Kimura;T. Matsui;H. Nishida;K. Nishiyama;H. Ohkuma;A. Tanaka;C. Kovac;D. McQueeney

1992 Proceedings 42nd Electronic Components & Technology Conference

Year: 1992 | Conference Paper |

Chemistry at interfaces: Electropositive metals on polymer surfaces

C. A. Kovac;J. L. Jordan-Sweet;M. J. Goldberg;J. G. Clabes;A. Viehbeck;R. A. Pollak

IBM Journal of Research and Development

Year: 1988 | Volume: 32, Issue: 5 | Journal Article |

Cited by: Papers (25)

This paper presents a study of chemical interactions between polymer surfaces and metal atoms deposited from the vapor phase. Such interactions may play an important role in interfacial metal-polymer adhesion. The chemical nature of the interface formed when an electropositive metal (chromium or cesium) is deposited onto the surface of PMDA-ODA polyimide has been investigated using chemical model ...Show More

Chemistry at interfaces: Electropositive metals on polymer surfaces

C. A. Kovac;J. L. Jordan-Sweet;M. J. Goldberg;J. G. Clabes;A. Viehbeck;R. A. Pollak

IBM Journal of Research and Development

Year: 1988 | Volume: 32, Issue: 5 | Journal Article |

IEEE Personal Account

Change username/password

Purchase Details

Payment Options
View Purchased Documents

Profile Information

Communications Preferences
Profession and Education
Technical interests

Need Help?

US & Canada: +1 800 678 4333
Worldwide: +1 732 981 0060
Contact & Support

Follow

A public charity, IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity.

IEEE Account

Change Username/Password
Update Address

Purchase Details

Payment Options
Order History
View Purchased Documents

Profile Information

Communications Preferences
Profession and Education
Technical Interests

Need Help?

US & Canada: +1 800 678 4333
Worldwide: +1 732 981 0060
Contact & Support

About IEEE Xplore
Contact Us
Help
Accessibility
Terms of Use
Nondiscrimination Policy
Sitemap
Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity.
© Copyright 2025 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.