Sandeep Chandra - IEEE Xplore Author Profile
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Sandeep Chandra

Also published under: Sandeep K. R. Chandra

Publications
5
Citations
53
Publications by Year
20072018
Co-Authors:
Show All Co-Authors (20)
Image of author Sandeep Chandra

Sandeep Chandra

Also published under: Sandeep K. R. Chandra

Affiliation

Electric Machine Drive Systems
Research & Advanced Engineering
Ford Motor Company, Dearborn, MI, USA

Publication Topics

Biography

Sandeep Chandra received the M.S. degree in electrical engineering from the University of Missouri-Rolla, Rolla, MO, USA, in 2007.,He is an Electromagnetic Compatibility (EMC) Research Engineer with Ford Motor Company, Dearborn, MI, USA. As an EMC engineer, he worked on the development of system level simulation and measurement techniques.(Based on document published on 18 October 2017).
Publications
5
Citations
53
Publications by Year
20072018
Co-Authors:
Show All Co-Authors (20)
Author's Published Works

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Evaluating Field Interactions Between Multiple Wires and the Nearby Surface Enabled by a Generalized MTL Approach

Yansheng Wang;Dazhao Liu;Ying S. Cao;Richard W. Kautz;Nevin Altunyurt;Sandeep Chandra;Jun Fan

IEEE Transactions on Electromagnetic Compatibility
Year: 2018 | Volume: 60, Issue: 4 | Journal Article |
Cited by: Papers (8)
Interactions between a cable harness containing multiple wires and the nearby metal surface can be evaluated by full-wave methods. Though these methods can calculate the interactions with great accuracy, they have long simulation times and large memory requirements when dealing with complex wire structures. The multiple scattering (MS) approach by treating the cable harness and the surface separat...Show More

Evaluating Field Interactions Between Multiple Wires and the Nearby Surface Enabled by a Generalized MTL Approach

Yansheng Wang;Dazhao Liu;Ying S. Cao;Richard W. Kautz;Nevin Altunyurt;Sandeep Chandra;Jun Fan

Year: 2018 | Volume: 60, Issue: 4 | Journal Article |

Accurate Evaluation of Field Interactions Between Cable Harness and Vehicle Body by a Multiple Scattering Method

Dazhao Liu;Yansheng Wang;Richard W. Kautz;Nevin Altunyurt;Sandeep Chandra;Jun Fan

IEEE Transactions on Electromagnetic Compatibility
Year: 2017 | Volume: 59, Issue: 2 | Journal Article |
Cited by: Papers (14)
Interactions between cable harness and vehicle body can be calculated using the full-wave method-of-moments (MoM) formulation. Although the full-wave MoM formulation can help us to calculate these interactions with great accuracy, it can be fairly time consuming when dealing with complex wire structures. On the other hand, the conventional multiconductor transmission-line theory can be used to obt...Show More

Accurate Evaluation of Field Interactions Between Cable Harness and Vehicle Body by a Multiple Scattering Method

Dazhao Liu;Yansheng Wang;Richard W. Kautz;Nevin Altunyurt;Sandeep Chandra;Jun Fan

Year: 2017 | Volume: 59, Issue: 2 | Journal Article |

Multi-GPU Accelerated Admittance Method for High-Resolution Human Exposure Evaluation

Zubiao Xiong;Shi Feng;Richard Kautz;Sandeep Chandra;Nevin Altunyurt;Ji Chen

IEEE Transactions on Biomedical Engineering
Year: 2015 | Volume: 62, Issue: 12 | Journal Article |
Cited by: Papers (6)
Objective: A multi-graphics processing unit (GPU) accelerated admittance method solver is presented for solving the induced electric field in high-resolution anatomical models of human body when exposed to external low-frequency magnetic fields. Methods: In the solver, the anatomical model is discretized as a three-dimensional network of admittances. The conjugate orthogonal conjugate gradient (CO...Show More

Multi-GPU Accelerated Admittance Method for High-Resolution Human Exposure Evaluation

Zubiao Xiong;Shi Feng;Richard Kautz;Sandeep Chandra;Nevin Altunyurt;Ji Chen

Year: 2015 | Volume: 62, Issue: 12 | Journal Article |

Prediction of Power Supply Noise From Switching Activity in an FPGA

Liehui Ren;Tun Li;Sandeep Chandra;Xiaohe Chen;Hemant Bishnoi;Shishuang Sun;Peter Boyle;Iliya Zamek;Jun Fan;Daryl G. Beetner;James L. Drewniak

IEEE Transactions on Electromagnetic Compatibility
Year: 2014 | Volume: 56, Issue: 3 | Journal Article |
Cited by: Papers (22)
Switching current drawn by an integrated circuit (IC) creates dynamic power supply noise on the IC and on the printed circuit board (PCB), which in turn causes jitter in I/ O signals and reduces the maximum clock frequency. Predicting power supply noise is challenging due to the complexity of determining the dynamic current drawn by the IC and the impedance of the power delivery network. In this p...Show More

Prediction of Power Supply Noise From Switching Activity in an FPGA

Liehui Ren;Tun Li;Sandeep Chandra;Xiaohe Chen;Hemant Bishnoi;Shishuang Sun;Peter Boyle;Iliya Zamek;Jun Fan;Daryl G. Beetner;James L. Drewniak

Year: 2014 | Volume: 56, Issue: 3 | Journal Article |

Engineering of Absorbing Gaskets Between Metal Plates

Marina Koledintseva;Sandeep K. R. Chandra;J. Drewniak;James A. Lenn

2007 IEEE International Symposium on Electromagnetic Compatibility
Year: 2007 | Conference Paper |
Cited by: Papers (3)
Engineering of absorbing materials for gaskets that would be used between two metal plates to reduce electromagnetic emissions and improve immunity of electronic equipment is considered. An analytical model of a composite based on the Maxwell Garnett formulation for multiphase mixtures, as well as the shielding effectiveness of this material, are presented. The full-wave numerical computational re...Show More

Engineering of Absorbing Gaskets Between Metal Plates

Marina Koledintseva;Sandeep K. R. Chandra;J. Drewniak;James A. Lenn

Year: 2007 | Conference Paper |

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