An Echo-Canceller-Iess NFIC- TSV Hybrid 3D Interconnect for Simultaneous Bidirectional Vertical Communication

This paper presents an echo-canceller-less wireless-wireline hybrid 3D interconnect for simultaneous bidirectional (SBD) vertical communication. This is accomplished by combining wireless near-field inductive coupling channel (NFIC) that encompasses wireline through-silicon via (TSV) channels to form a bidirectional vertical link for the first time using face-to-back 3D integration technologies applicable for multi-layer vertical communication. In experimental demonstration, the transceiver simultaneously communicates at an effective data rate of 6 Gb/s consuming 290 fJ/bit over the NFIC and TSV channels in 65nm CMOS process. The developed hybrid interconnect architecture exhibits more than \pmb 2× improved link performance over state-of-the-art 3D SBD link.

I. Introduction

T3D integration is disruptive technology that provides higher device density, low power consumption, and wide inter-die bandwidth [1]. The heterogeneous integration of multiple planar dies fabricated with different technologies achieves a complete System-in-Package (SiP) composed of logic processing circuits, memory arrays, analog and RF signal processing circuits, and sensor front-end circuits [1].