I. Introduction
The conventional Metal Oxide Semiconductor field effect transistors (MOSFETs) have short channel effect problem due to continuous decreases of device sizes at nano scale regime. However, when the channel length shrinks it reduces the controllability of the gate over the depletion region by increased charge sharing from source/drain. Short channel effect such as threshold voltage roll-off and Drain Induced Barrier Lowering (DIBL). Multi-gate devices such as gate-all-around Si nano-wires and FinFETs are promising candidates for CMOS downscaling. Conventional MOSFET devices formation of source and drain junctions has big challenges on doping techniques and thermal budget. To overcome these challenges as an, alternative junction-less devices with uniform doping concentration [2] is the better candidate their electrical characteristics have been analyzed and studied [7].