An ultra-thin bendable Si-monolithic imaging test sensor

In this work an ultra-thin bendable imaging test structure is presented and experimental results are put forward. The deployed design and layout rules in order to achieve an independent operation on the applied mechanical stress are discussed. Moreover, experimental results of the optical characteristics of standard n⁺/p photodiodes on ultra-thin silicon chips embedded into a polyimide foil under several bending configurations are discussed and presented.

Introduction

Flexible electronics based on ultra-thin silicon chips have gained an increasing attention during the last years with applications ranging from foldable displays up to consumer and biomedical devices [1].