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Predicting TEM cell measurements from near field scan data

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Published in: 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006.

Date of Conference: 14-18 August 2006

Date Added to IEEE Xplore: 09 October 2006

Print ISBN:1-4244-0293-X

ISSN Information:

DOI: 10.1109/ISEMC.2006.1706371

Conference Location: Portland, OR, USA

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I. Introduction

IEC standard 61967 defines methods to measure conducted and radiated electromagnetic disturbances from integrated circuits (ICs) [1], [2]. In many cases, the potential for an IC to couple to nearby objects and drive emissions is measured using the TEM-cell method (Part 2 of IEC 61967). A special TEM cell board must be manufactured to make this measurement. Unfortunately, the manufacture of this board may not be practical in all cases. In these instances, it may be more desirable to predict the TEM cell measurement from other measurements that can be made with more general test setups.

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