Conferences >2006 IEEE International Sympo...

Quantifying electric and magnetic field coupling from integrated circuits with TEM cell measurements

Download PDF
Download References
Request Permissions
Save to
Alerts

Metadata

First Page of the Article

Published in: 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006.

Date of Conference: 14-18 August 2006

Date Added to IEEE Xplore: 09 October 2006

Print ISBN:1-4244-0293-X

ISSN Information:

DOI: 10.1109/ISEMC.2006.1706339

Conference Location: Portland, OR, USA

First Page of the Article

Hide First Page Preview

Contents

I. Introduction

The twin standards SAE J1752/3 [1] and IEC 61967–2 [2] describe procedures for evaluating the electromagnetic compatibility of integrated circuits (ICs). These procedures call for the IC to be mounted on a 10-cm × 10-cm printed circuit board with the IC being evaluated on one side and the other components needed to exercise the IC on the other side. The board is mounted in the wall of a small TEM (or GTEM) cell with the IC side facing in. Voltage measured on one end of the cell is used to evaluate the performance of the IC from 150 kHz to 1 GHz.

References is not available for this document.

Quantifying electric and magnetic field coupling from integrated circuits with TEM cell measurements

Metadata

ISSN Information:

I. Introduction

References

IEEE Account

Purchase Details

Profile Information

Need Help?

Quantifying electric and magnetic field coupling from integrated circuits with TEM cell measurements

Alerts

Metadata

ISSN Information:

I. Introduction

References