I. Introduction
The miniaturization and high-speed development of modern electronic devices have complicated the electromagnetic environment of printed circuit board (PCB), posing new challenges for electromagnetic interference (EMI) design. Although shielding box can isolate the EMI coupling between inside and outside of the shielding box, the interference within the shield becomes increasingly crucial as components get closer and frequencies higher. Therefore, assessing the radiation emissions inside the shield is an urgent issue to address.