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We investigated the effect of the deposition temperature on the electrical performance of SiOx passivation layers for amorphous indium-gallium-zinc-oxide thin-film transistors (a-IGZO TFTs). Compared to the time-of-flight secondary ion mass spectroscopy depth profile of the IGZO film with a SiOx passivation layer deposited at low temperature (150oC ), that with the SiOx film formed at 300oC exhibi...Show More
The effect of SiN surface passivation on high-frequency channel noise in AlGaN/GaN high-electron-mobility transistors on a high-resistivity Si substrate is investigated. It was observed that the channel noise increased after SiN surface passivation by plasma-enhanced chemical vapor deposition. The mean square of the channel noise voltage increased about three times at a bias of Vd = 12V and Id = 1...Show More
The process of cadmium zinc telluride (CZT) surface passivation is very important to reduce the leakage current of the detector and to improve the detector performance. NH4/H2O2 solution was identified as an effective passivation agent for CZT. We fabricated a CZT planar detector and measured the detector performances before and after the NH4/H2O2 passivation. For the first time, the passivation e...Show More
In this work, we investigated the surface passivation performance of thermal atomic layer deposited Al2O3 films using two different grades of trimethylaluminum (TMA). All films were grown on the InPassion Lab tool from SoLayTec. We demonstrate that the surface passivation quality is not compromised by the higher impurity concentration in the cheaper solar grade TMA. Excellent passivation on both p...Show More
We have carried out systematic experiments based on degradation mechanisms of GaN high electron mobility transistors (HEMT). The electro-thermo-mechanical properties of AlGaN/GaN are simulated for reliability testing under different temperature and bias conditions. The effect of surface passivation on undoped AlGaN/GaN HEMT is investigated using SiO2. This passivation layer can increase the electr...Show More
A new class of passivation material, ternary AlxMg1-xOy is developed and its surface passivation and interface properties on silicon surfaces are investigated in this study. Super-cycle plasma-enhanced atomic layer deposition is employed to fabricate AlxMg1-xOy thin films and can effectively engineer physical properties of the thin films. Our study also shows that the developed AlxMg1-xOy can prov...Show More

Surface Passivation Applicable to InAsSb/GaSb Photodiodes for Infrared Detection

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SAIEE Africa Research Journal
Year: 2010 | Volume: 101, Issue: 1 | Journal Article |
In this paper the influence of various anodisation solutions on the surface passivation of InAsSb/GaSb photodiodes is examined. The diode structure is based on a design reported by Bubulac et al. [1]. The diode consists of a p-i-n structure grown by MOCVD and nearly lattice matched to a GaSb substrate. The structure, p-InAs1-xSbx/n-InAs1-xSbx/n-GaSb (x = 0.10 in both cases), consisted of a Zn-dope...Show More

Surface Passivation Applicable to InAsSb/GaSb Photodiodes for Infrared Detection

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Year: 2010 | Volume: 101, Issue: 1 | Journal Article |
Al2O3 film with SiNx capping layer is widely used for rear side passivation of p-type PERC cells and passivation of p+ emitter in n-PERT cells because of very effective field-induced passivation by high density of negative charge in Al2O3 (5e12~1e13cm-2). This paper reports on a promising field-effect passivation by charge injection in SiO2/SiNx stack using a novel low-cost plasma charging method ...Show More
This letter studies the influence of the passivation thickness on the device characteristics of InAlGaN/GaN high-electron-mobility transistors with a gate length between sub-30 and 70 nm. As the Al2O3 passivation thickness increases, the current collapse in 80-μs pulsed-I -V measurements decreases from 30% to 13%, while dc characteristics are almost unchanged with the exception of increasing drain...Show More
We report on the effect of Al2O3 surface passivation on electrical properties of beta-gallium oxide (β-Ga2O3) nanomembrane field-effect transistor (FET). The fabricated bottom-gate β -Ga2O3(100) FET exhibits enhanced channel conductance and reduced hysteresis after the conformal atomic layer deposited Al2O3 passivation investigated by high-resolution transmission electron microscope (HR-TEM) analy...Show More
Effects of silicon nitride (SiN) surface passivation by plasma enhanced chemical vapor deposition (PECVD) on microwave noise characteristics of AlGaN/GaN HEMTs on high-resistivity silicon (HR-Si) substrate have been investigated. About 25% improvement in the minimum noise figure (NF min) (0.52 dB, from 2.03 dB to 1.51 dB) and 10% in the associate gain (G a) (1.0 dB, from 10.3 dB to 11.3 dB) were o...Show More
A bilayer coating of Al2O3 and TiO2 is used to simultaneously achieve excellent passivation and low reflectivity on p-type silicon. This coating is targeted for achieving high efficiency n-wafer Si solar cells, where both passivation and anti-reflection (AR) are needed at the front-side p-type emitter. It could also be valuable for front-side passivation and AR of rear-emitter and interdigitated b...Show More
A lattice-matched InAlGaN/GaN heterostructure with a barrier-layer thickness of 4 nm has been grown and passivated in situ with a 63-nm SiN by metal-organic chemical vapor deposition. Enhancement-mode heterostructure field-effect transistors have been realized by a fluorine-based surface treatment after the local removal of the SiN. The threshold voltage and transconductance were 0.65 V and 250 mS...Show More
Cu/SiO2 hybrid bonding process with short duration (1 minute) has been successfully performed at low temperature (120 °C) under the atmosphere with metal passivation material. Electrical performance (over 15K daisy chain and 10−8 Ω-cm2 specific contact resistance), mechanical strength (>15kgf), and reliability have been conducted to verify its excellent bonding quality. This method of hybrid bondi...Show More
SiGe metal-semiconductor-metal photodetectors (MSM-PDs) with a thin amorphous silicon (a-Si:H) passivation layer have been fabricated by an ultrahigh-vacuum chemical vapor deposition (UHVCVD) system. It was found that the thin (30 nm) a-Si:H passivation layer could effectively suppress the dark current of SiGe MSM-PDs. As compared to the unpassivated devices, the dark current for devices with a-Si...Show More
AlGaN/GaN-based high electron mobility Transistors (HEMTs) were fabricated on Si substrate. Surface passivation effect on AlGaN/GaN HEMTs was investigated with hafnium silicate (HfSiOx) passivation layer deposited by atomic layer deposition (ALD) at 250 °C. The DC current-voltage characteristics (ID-VD), pulsed ID-VD characteristics, and transfer characteristics of the device were compared before ...Show More
In this work we use 3D numerical simulations to design optimized point contacts in back-side passivated CIGS cells. We performed a detailed analysis of point contact size for different CIGS thickness, contact specific resistance, as well as chemical and field-effect passivation properties. The role of CIGS energy gap back-grading in improving the performance of cells with different absorber thickn...Show More
Schottky barrier diodes (SBD) were fabricated on SiC surfaces that had been treated with different surface passivation techniques, so that metal-semiconductor analysis could be used to evaluate the quality of this surface. In this paper, we discuss the results of this study that used Current-Voltage (I-V), Capacitance-Voltage (C-V) and Current-Voltage-Temperature (I-V-T) analysis to look at the im...Show More
SCREAM process for releasing micromechanical MEMS structures using plasma polymerized fluorocarbon thin film for trench sidewall passivation is reported. The developed process is designed as a one mask process, and all etchings and depositions are fabricated in the same etching system (standard capacitive coupled RIE), as one-step-one-run process.Show More
We investigated effect of an Al2O3 passivation layer on threshold voltage shift (ΔVth) of Al2O3 insulator/In-Si-O-C thin-film transistors (TFTs) under several gate bias stress conditions. A large ΔVth due to the four components such as electron trap, hole trap at around the valence band edge, deep trap, and generated hole was observed in In-Si-O-C TFT. By introducing an Al2O3 passivation layer, ΔV...Show More
In order to enhance the effect of sulfur passivation, the influence of solution polarity on the passivation was investigated; With the following conclusion: the smaller polarity of the solution, the better effect of the passivation. A novel passivation solution made up of (NH4)2S+Se+t-C4H9OH has been prepared. The PL spectrum intensity of the samples treated by (NH4)2S+Se+t-C4H9OH is 23 times stro...Show More
In this study, sulfur-passivation of GaAs surface is used to fabricate free interface state densities in Au/n-GaAs Schottky barrier diodes (SBDs). The effect of passivation on Schottky diode parameters such as ideality factor (n), Schottky barrier height (φB0) and reverse saturated current (Is) were investigated by the current-voltage (I-V) characteristic. The results indicate that the Schottky ba...Show More
It is long recognized that the effective surface clean is critical for the increased performance of solar cell and semiconductor devices. In this contribution, we introduced the effectiveness of crystalline silicon surface clean by a simple ultraviolet-ozone (UVo) process by comparing it against the industry standard RCA and UV assisted deionized water (DiO3) techniques. Despite being simple, UV-o...Show More
The optimized structure of the Photoelectron in-situ sensing device (PISD) is designed, and its performance is studied through TCAD simulation. The results indicate that the use of embedded photodiode with interface passivation effectively suppresses the adverse effects of interface traps, leading to improved device performance. A comparison is made between two possible passivation approaches for ...Show More
To obtain a stable passivation layer with high performance, we use the highly alkaline hydrazine solution to passivate GaAs (100) surface, the native oxidation layer has been effectively removed. The PL intensity was found higher than that of the untreated sample, no obvious PL-intensity degradation was observed during a long period exposure to air.Show More