Showing 1-25 of 387 resultsfor "Index Terms":Initial Grain
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Dynamic recrystallization and grain growth behavior of 20SiMn low carbon alloy steel
Tsinghua Science and Technology
Cited by: Papers (1)
A series of thermodynamics experiments were used to optimize the hot forging process of 20SiMn low-carbon alloy steel. A dynamic recrystallization and grain growth model was developed for the 20SiMn steel for common production conditions of heavy forgings by doing a nonlinear curve fit of the experiment data. Optimized forging parameters were developed based on the control of the dynamic recrystal...Show More
Dependence of the Mean Grain Size and Coercivity of Sintered Nd–Fe–B Magnets on the Initial Powder Particle Size
The grain size and magnetic properties of sintered Nd14.3 Fe78.9TM1.2B5.6(TM: Co, Cu, Al, Ga) magnets have been examined in dependence on the powder particle size and distribution. The mean grain size decreases almost linearly with the mean particle size and seems to become more homogeneous with a decreasing width of the particle size distribution. The coercivity increases with decreasing grain si...Show More
An effective grain growth model using a combination of Voronoi tessellation and Monte Carlo method
Chihak Ahn;Seonghoon Jin;Gijae Kang;Joohyun Jeon;Hyoshin Ahn;Inkook Jang;Woosung Choi;Dae Sin Kim
2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
Year: 2023 | Conference Paper |
We present an efficient simulation method for metal grain growth that combines Voronoi tessellation and the Monte Carlo method. The accuracy of our model is validated through its ability to reproduce theoretical predictions of film stress and grain boundary energy. The model can identify stress hot spots and generate grain size statistics potentially useful for estimating metal line failure. Our r...Show More
On the increase in the recrystallization temperature of nanostructured vacuum copper based condensates
2017 IEEE 7th International Conference Nanomaterials: Application & Properties (NAP)
Year: 2017 | Conference Paper |
The structure of Cu-Ta and Cu-Mo condensates obtained by electron-beam evaporation from various sources in a vacuum is studied. It is shown that alloying copper condensates with tantalum and molybdenum disperses the grain structure of the copper matrix from micro- to nanoscale dimension as a result of the formation of grain boundary segregations by these elements that are formed on the surface of ...Show More
The effect of initial growth interface on the grain structure in HPMC-Si ingot
Giri Wahyu Alam;Etienne Pihan;Benoit Marie;Nathalie Mangelinck-Noël
2017 International Conference on Sustainable Energy Engineering and Application (ICSEEA)
Year: 2017 | Conference Paper |
Seeding is an explored way to control the final structure of Silicon PV ingots. In HPMC-Si (High Performance Multi-Crystalline-Silicon) ingots, nucleation on numerous seed grains creates grain boundaries that can terminate the propagation of dislocation clusters. In the present work, we focus on the impact of the initial growth in G2 ingots that were prepared by directional solidification with a s...Show More
Research on the inner grain evolution and distribution during stretching of shaft heavy forgings
2010 International Conference on Mechanic Automation and Control Engineering
Year: 2010 | Conference Paper |
Cited by: Papers (1)
It's an important method to improve the mechanical properties of forging by studying variation of the crystal grain and realizing the quantitative prediction of the forging process. The inner grain evolutionary model during stretching of shaft heavy forging was established by the microstructure project module based on the cellular automata method of Deform-3D software. The variations and distribut...Show More
Monte Carlo simulation of microstructure evolution during thermo-mechanical rolling of steel using grid computing technology
2013 National Conference on Parallel Computing Technologies (PARCOMPTECH)
Year: 2013 | Conference Paper |
Cited by: Papers (2)
A Monte Carlo (MC) simulation methodology using high performance computing (HPC) has been proposed to characterize grain growth kinetics and recrystallisation phenomena during hot rolling of C-Mn and TRIP steels. The simulation framework comprises of mesoscale modelling of evolution of grain growth and microstructure incorporating the system energetics of grain boundary energy and stored energy wh...Show More
Effects of Grain Size and Interstitial Content on Recrystallization in Nb After Cold Rolling
Thomas J. Bennett IV;Eric M. Taleff;Pashupati Dhakal;Shreyas Balachandran;Peter J. Lee;Thomas R. Bieler;Philip Eisenlohr
A fully recrystallized microstructure with a fine grain size can improve the performance of superconducting radio-frequency cavities produced from high-purity Nb (ASTM B393–18 Type 5 Nb) while providing mechanical strength. Recrystallization depends on impurity content, initial microstructure, deformation state, and annealing conditions. To better understand how fine-grained, fully recrystallized ...Show More
Cube Textured Substrates for YBCO Coated Conductors: Influence of Initial Grain Size and Strain Conditions During Tape Rolling
A. Vannozzi;A. Augieri;G. Celentano;L. Ciontea;F. Fabbri;V. Galluzzi;U. Gambardella;A. Mancini;T. Petrisor;A. Rufoloni
The realization of high critical current density YBCO-based coated conductors in the RABiTS approach is primarily related to the sharpness of cube texture developed in the substrate. Among the various proposed Ni-based tapes, Ni-W alloys have attracted a particular interest either because of the enhanced mechanical properties and reduced magnetism with respect to pure Ni, or of the sharp and almos...Show More
Microstructure Analysis on Size Distribution During Film Growth in HAMR Media
Bing Zhou;B. S. D. C. S. Varaprasad;Enbo Zhang;David E. Laughlin;Jian-Gang Zhu
IEEE Transactions on Magnetics
Cited by: Papers (2)
Grain size and size distribution reduction in L10 FePt granular thin film is becoming critical to increase the areal storage density and realize the full potential of heat-assisted magnetic recording media. FePt and amorphous carbon or mixture with other segregants are often deposited at elevated temperature in order to promote the L10 ordering in FePt. Due to the materials system and high tempera...Show More
Improving the Microstructure of ZnO-Based Metal Oxide Varistors Using Cold Sintering
2024 IEEE Electrical Insulation Conference (EIC)
Year: 2024 | Conference Paper |
Metal oxide varistors (MOVs) are well established as surge arrestors to protect AC power transmission and distribution apparatus. Unlike the rare lightning-induced surges in AC application, MOVs are required to absorb energy repeatedly and frequently in DC circuit breakers (DCCBs). Therefore, further advances in lifetime and reliability are needed to develop MOVs for high-efficiency DCCBs. Microst...Show More
Analysis and Prospects of Using Ultrafine-Grain Copper for Highly Loaded Cable Systems
Anastasiia Symonova;Volodymyr Dragobetskyi;Ruslan Puzyr;Olena Naumova
2023 IEEE 5th International Conference on Modern Electrical and Energy System (MEES)
Year: 2023 | Conference Paper |
This scientific article delves into the analysis and prospects of utilizing ultrafine-grain copper for highly loaded cable systems. The potential applications of new ultra-fine-grained and nanostructured metal conductors in various fields, such as heavily loaded cable systems, windings of motors and generators, low-current computer networks, and devices operating under challenging conditions were ...Show More
Analysis and Prospects of Using Ultrafine-Grain Copper for Highly Loaded Cable Systems
Anastasiia Symonova;Volodymyr Dragobetskyi;Puzyr Ruslan;Olena Naumova
2023 IEEE 5th International Conference on Modern Electrical and Energy System (MEES)
Year: 2023 | Conference Paper |
This scientific article delves into the analysis and prospects of utilizing ultrafine-grain copper for highly loaded cable systems. The potential applications of new ultra-fine-grained and nanostructured metal conductors in various fields, such as heavily loaded cable systems, windings of motors and generators, low-current computer networks, and devices operating under challenging conditions were ...Show More
Reaction Processes between Tholeiitic Melt and Residual Peridotite in the Uppermost Mantle: an Experimental Study at 0·8 GPa
We present the results of a series of anhydrous piston cylinder experiments that illustrate the mechanisms and implications of reaction between tholeiitic melt and depleted peridotite in the uppermost mantle. To simulate infiltration–reaction processes we have applied a three-layer setup in which a layer of primitive basaltic powder (‘melt layer’) is consecutively overlain by a ‘peridotite layer’ ...Show More
Initial recrystallization texture and magnetic induction in single-oriented electrical steel
IEEE Transactions on Magnetics
Cited by: Papers (4)
Initial recrystallization texture is influenced by the bulk content of sulfur and by the final reduction. At a given bulk content of sulfur, a lower final reduction is favorable for obtaining the initial {011} Goss texture. Under a fixed final reduction, a lower bulk content of sulfur is good for this purpose. As the intensity of initial Goss texture increases, it is easier to obtain magneti...Show More
Microstructure investigation of TSV copper film
2013 IEEE 63rd Electronic Components and Technology Conference
Year: 2013 | Conference Paper |
Cited by: Papers (2)
Copper Through-Silicon Via (Cu TSV) is becoming a key technology for three dimensional (3D) packaging and 3D integrated circuit (IC) applications. The microstructure of the Cu TSV is important as it not only affects the electrical properties, but ma y play a role in its reliability such as protrusion. In this study, physical vapor deposition (PVD) and electroplated (ECP) Cu TSV microstructure evol...Show More
Microstructure evolution of electroplated Cu during room temperature transient
M.A. Gribelyuk;S.G. Malhotra;P.S. Locke;P. DeHaven;J. Fluegel;C. Parks;A.H. Simon;R. Murphy
Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)
Year: 2000 | Conference Paper |
Cited by: Papers (1)
Previously the Cu resistance transient time was found to be dependent on the electroplating current. It was shown that longer transient times were correlated with a greater incorporation of plating impurities for the bath chemistry used in this study. The present work shows that the grain growth that occurs during the resistance transient is initiated by the formation of abnormally large grains, w...Show More
The microstructural development during nucleation and growth processes is studied numerically. Most of the studies are for the simple case of constant nucleation and growth rates, but a brief discussion is made of the effect of time-dependent nucleation and growth. A 3-D code is used which accounts for not only the nucleation and growth of individual new grains, but also the effects of grain impin...Show More
Effect of Initial Grain Size on Growth Behavior of Intermetallic Compounds on (001)Cu During Aging
Chong Dong;Haoran Ma;Dan Zhang;Xiaofu Li;Jie Yu;Liuhong Yang;Haitao Ma
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Year: 2022 | Conference Paper |
Cu6Sn5 is the main intermetallic compound between the Sn-based solder and Cu substrate. And the orientation of Cu6Sn5 is one of the key factors affecting its electrical, thermal, and mechanical properties. Besides, under bump metallization may only contain one grain in a limit case due to the decrease of the solder joint. Therefore, the orientation-preferred Cu6Sn5 on Cu single crystal attracts a ...Show More
Static and metadynamic recrystallization of low carbon steels during mechanical deformation
Static and metadynamic recrystallization models were developed with the coefficients determined by multiple nonlinear regression analyses to describe microstructure evolution in low carbon steels. The effects of initial grain size, deformation temperature, strain, and strain rate on the austenitic recrystallized volume fraction and grain size were studied using a Gleeble machine. The results show ...Show More
Grains-growth and clustering effects on boron diffusion in polysilicon during thermal post-implantation annealing
Proceedings. The 16th International Conference on Microelectronics, 2004. ICM 2004.
Year: 2004 | Conference Paper |
Cited by: Papers (1)
We propose a double diffusion model adapted to the granular structure of polysilicon and to the effects of high concentrations. This model takes account of the temporal and thermal changes of the morphological structure of polysilicon, by the grains growing in size, during the thermal post-implantation treatment. In addition, it combines the effects of the trapping and the segregation of dopant to...Show More
Spontaneous Modification of Grain Boundary Configuration and its Application for Realization of Bulk Multicrystalline Si with Electrically Inactive Grain Boundaries
Noritaka Usami;Kentaro Kutsukake;Takamasa Sugawara;Kozo Fujiwara;Wugen Pan;Yoshitaro Nose;Toetsu Shishido;Kazuo Nakajima
2006 IEEE 4th World Conference on Photovoltaic Energy Conference
Year: 2006 | Conference Paper |
We utilized bi-crystals with an artificially designed grain boundary configuration as a seed for floating-zone growth of multicrystalline Si (mc-Si) in order to clarify the impact of the initial grain boundary configuration on the crystal growth. Intentionally introduced large tilt deviation from Sigma3 was found to lead to appearance of new crystal grains accompanied by spontaneous modification o...Show More
Structure character of fast growth polycrystalline silicon film from SiCl/sub 4//H/sub 2/
Rui Huang;Xuanying Lin;Yunpeng Yu;Kuixun Lin;Junhong Wei;Shunhui Lin;Chuying Yu
Conference Record of the Thirty-first IEEE Photovoltaic Specialists Conference, 2005.
Year: 2005 | Conference Paper |
The polycrystalline silicon films with the deposition rate over 4.5 /spl Aring//s prepared at low temperature of 250 /spl deg/ were obtained from the hydrogen dilution of tetrachlorine silicon using PECVD technique. The results show that the growing surface of film contains a large amount of silicon crystalline grains with 30-100 nm in diameter. The crystalline fraction and the crystalline grain s...Show More
Research on the thermal simulation experiment of AZ80A magnesium alloy
2011 Second International Conference on Mechanic Automation and Control Engineering
Year: 2011 | Conference Paper |
Cited by: Papers (1)
By the compression tests on a Gleeble-1500 thermo-mechanical simulator to study on the mechanics and the DRX behaviours of AZ80A magnesium alloy in the temperature between 593K and 683K and strain rates between 0.01 s−1 and 10s−1. The activation energy of AZ80A Magnesium Alloy in the deformation condition is 201.78×103 J/mol, and the relationship can be described by the Zener-Hollomon parameter in...Show More
An advanced model for dopant diffusion in polysilicon
A two-dimensional simulation model for dopant diffusion in polysilicon has been developed, which includes dopant clustering in grain interiors as well as in grain boundaries. The grain growth model is coupled with the diffusion coefficient of the dopants and the process temperature based on thermodynamic concepts. For high dose implantation cases the trapping/emission mechanism between grain inter...Show More
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