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New Architecture Elements for 5G RF Front End Modules
Florinel Balteanu;Serge Drogi;Hardik Modi;Yunyoung Choi;Junhyung Lee;Sabah Khesbak;Bipul Agarval
2019 IEEE Asia-Pacific Microwave Conference (APMC)
Year: 2019 | Conference Paper |
Cited by: Papers (5)
The global smartphone shipments has reached more than 1.4 billion units each year and is one of the main driving engine behind semiconductor industry. The transition from 3G/4G to 5G is expected to bring higher data rates, low latency and new user applications in areas such as traffic safety, control and industrial application. These new applications will require faster multi-connectivity for smar...Show More
5G RF Front End Module Architectures for Mobile Applications
Florinel Balteanu;Hardik Modi;Yunyoung Choi;Junhyung Lee;Serge Drogi;Sabah Khesbak
The explosive growth and adoption of smartphones provides access to voice and data for billions of people worldwide today and connected devices are expect to reach 5.6 billion in 2020. This growth has been and continues to be the engine for semiconductor industry due to required computational power of CMOS technology in lower feature nodes as FinFet 7nm/14nm for application processors, modems and ...Show More
Design of a miniaturized RF front-end module with antenna array for 5G millimeter-wave communication
2021 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)
Year: 2021 | Conference Paper |
Cited by: Papers (3)
The RF front-end module integrated with the antenna array is one of the key components in the system of 5G millimeter-wave communication, while helps to effectively reduces the insertion loss and circuit size. However, most of them are designed or assembled together which reduces the maintainability of the systems. This work presents a design of miniaturized RF front-end module integrated with ant...Show More
Implementation of a Highly Integrated Triple-Band RF Front-End Module
Dongsu Kim;Jong In Ryu;Hyun-Min Cho;Nam-Kee Kang;Jun Chul Kim
This paper presents a highly integrated low temperature co-fired ceramic (LTCC) RF front-end module (FEM) for cellular/GPS/PCS applications. First, a triplexer composed of two diplexers and a GPS SAW filter has been implemented. Measured results of the triplexer are summarized and compared with simulated results. Next, a cellular SAW duplexer has been integrated into the triplexer with a PI networ...Show More
Integrated Filter and RF Front-end Module on RF SOI
Humberto Campanella;You Qian;Christian Romero;Joan J. Giner;Rakesh Kumar
2019 Electron Devices Technology and Manufacturing Conference (EDTM)
Year: 2019 | Conference Paper |
Cited by: Papers (5)
This work reports a monolithically integrated filter and RF front-end module architecture on 200-mm 7SWTSOI RFSOI technology. Multiple bulk acoustic wave (BAW) and Lamb wave filters are vertically integrated to RFSOI switches to demonstrate a variety of RF front-end modules. Vertical integration enables higher-density modules with reduced footprint and minimum impact in the electrical performance ...Show More
A GPS/BT/WiFi triple-mode RF FEM using Si- and LTCC-based embedded technologies
Beom Cheol Ham;Dong Ho Kim;Jong Min Yook;Jong In Ryu;Jun Chul Kim;Jong Chul Park;Young Cheol Park;Dongsu Kim
2012 IEEE/MTT-S International Microwave Symposium Digest
Year: 2012 | Conference Paper |
Cited by: Papers (2)
This paper presents a compact GPS/BT/WiFi triple-band triple-mode RF front-end module (FEM) with Si-based embedded actives and LTCC-based embedded passives. The proposed RF FEM consists of a triplexer, baluns, matching circuits in the LTCC substrate, and a PA, an LNA, a SAW filter on the LTCC substrate. Furthermore, the proposed FEM has a silicon module on top of the LTCC substrate in which three ...Show More
Study of Flexible RF Front-end Module Based on Liquid Crystal Polymer Substrate
Lizheng Zhang;Kai Chen;Guilian Chen;Junjun Cheng;Yan Luo;Wei Shen
2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT)
Year: 2020 | Conference Paper |
Cited by: Papers (1)
In this study, a miniature and high performance RF front-end module based on liquid crystal polymer (LCP) substrate is presented. The module consists of microstrip low pass filter (LPF) and low noise amplifier (LNA). The LPF with high rejection is directly fabricated on the LCP substrate, and LNA is mounted on the surface of LCP substrate cavity. The novelty of the proposed module is that it can r...Show More
Multiple Transmitter Coexistence for 5G RF Front End Modules
Florinel Balteanu;Serge Drogi;Yunyoung Choi;Junhyung Lee;Hardik Modi;Sabah Khesbak;Bipul Agarwal
Worldwide adoption of 4G LTE smartphones and the actual transition to 5G is the main driving engine for semiconductor industry. 5G is expected to reach high data rate speed (1Gbps) and low latency (less than 1ms). 5G will require more RF bandwidth and therefore an increase in the number of components such as SOI switches, acoustic filters and power amplifiers integrated in few RF front end modules...Show More
Integration of multi-standard front end modules SOCs on high resistivity SOI RF CMOS technology
F. Gianesello;S. Boret;B. Martineau;C. Durand;R. Pilard;D. Gloria;B. Rauber;C. Raynaud
2010 IEEE Radio Frequency Integrated Circuits Symposium
Year: 2010 | Conference Paper |
Cited by: Papers (2)
RF front end modules (FEMs) are currently realized using a variety of technologies. However, since integration drives wireless business in order to achieve the appropriate cost and form factor, we see significant research concerning FEM integration on silicon. In this quest, SOI technology has already addressed two key blocks, the antenna switch and the power amplifier. In this paper, we will focu...Show More
An Integrated K-Band Receiving Front-End Module for Satellite Communication
Zhong-Lin Xu;Zheng Dong;Hong-Tao Liao;Liang-Feng Qiu;Sheng-Tuan She;Lin-Sheng Wu;Jun-Fa Mao
2021 International Conference on Microwave and Millimeter Wave Technology (ICMMT)
Year: 2021 | Conference Paper |
In this work, a four-channel RF receiving front-end module is developed in multilayer low-temperature co-fired ceramic for satellite communication with the operating frequency band of 17.7~20.2 GHz. The dies of low noise amplifiers, phase shifters, attenuators and series-to-parallel convertors are integrated within the volume of 28×28×1.25 mm3, together with an embedded power combiner and lowpass ...Show More
Highly Integrated Multi-Channel RF Front-End Module
2023 IEEE MTT-S International Wireless Symposium (IWS)
Year: 2023 | Conference Paper |
Cited by: Papers (1)
As the most front-end part of the frequency conversion system, the RF front-end module undertakes the function of amplifying the RF signal. The RF front-end part includes the self-checking power dividing function. The self-checking power dividing function is to divide the self-checking signal into each channel and provide the self-checking signal for each channel. In this paper, by selecting the i...Show More
A wide-band RF Front-end module for 5G mMIMO applications
Mike Fraser;Venkata N.K Malladi;Joseph Staudinger;Chun-Wei Chang
2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)
Year: 2020 | Conference Paper |
Cited by: Papers (3)
This paper presents a 2-5 GHz mMIMO RF front-end module that includes an RF switch followed by two stages of low-noise amplifiers (LNA). The switch and LNAs are designed in 0.25um GaAs technology as two ICs, placed in a multi-chip module (MCM) and housed in a LGA package. The FEM achieves 47 dBm peak power handling in failsafe (FS)/TX mode, 1.35 dB noise figure, 31.5 dBm OIP3 and 17 dBm P1dB at 3....Show More
Interconnect verification of multichip modules using boundary scan
Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's
Year: 1991 | Conference Paper |
Cited by: Papers (1)
Certainly one of the key factors in the manufacture of multichip modules (MCM) is the verification and fault diagnosis of an MCM's structural interconnects. High performance MCM products, which are clearly an expensive technology, will incur additional costs unless appropriate diagnostic tools are made available for fast failure analysis during production test. Boundary scan implementation is key ...Show More
This paper describes a design for a front-end module to receive satellite DMB service. The front-end module designed in this study is a planar structure that is easy to install on the rooftop of a car and is compact in size. In addition, it can be applied to certain commercial models because it has low noise and high gain characteristics. The impedance bandwidth of antenna is 7.04 % (186 MHz), and...Show More
Highly linear and sub 120 fs Ron × Coff 130 nm RF SOI technology targeting 5G carrier aggregation RF switches and FEM SOC
F. Gianesello;A. Monroy;V. Vialla;E. Canderle;G. Bertrand;M. Buczko;M. Coly;Jeff Nowakowski;N. Revil;L. Rolland;D. Gloria;A. Juge;S. Gachon;J. P. Aubert;E. Granger
2016 IEEE 16th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)
Year: 2016 | Conference Paper |
Cited by: Papers (19)
RF front end modules (FEMs) are currently realized using a variety of technologies. However, since integration drives wireless business in order to achieve the appropriate cost and form factor, CMOS Silicon-on-insulator (SOI) has emerged over the past few years as the dominant technology for RF switches in RF FEMs for cell phones and WiFi [1]. While current performances available on RF SOI technol...Show More
Highly linear and sub 120 fs Ron × Coff 130 nm RF SOI technology targeting 5G carrier aggregation RF switches and FEM SOC
F. Gianesello;A. Monroy;V. Vialla;E. Canderle;G. Bertrand;M. Buczko;M. Coly;Jeff Nowakowski;N. Revil;L. Rolland;D. Gloria;A. Juge;S. Gachon;J. P. Aubert;E. Granger
Year: 2016 | Conference Paper |
Performance Optimization of FBAR Filters with Wafer-Level Chip-Scale Package Using Embedded Matching Inductors on Multilayer PCB
Huaiqiang Yu;Xi Wang;Xiao Peng;Lei Zhang;Pingying Jiang;Xuemei Zhao;Like Deng;Jinyi Ma
2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
Year: 2022 | Conference Paper |
Cited by: Papers (1)
This work presents an embedded matching scheme on the multilayer print circuit board (PCB) for film bulk acoustic resonator (FBAR) filters with wafer-level chip-scale package (WL-CSP), which are widely used in front-end modules (FEMs) for mobile communication. The matching inductors connected in parallel to ground with different inductance are designed and integrated into the middle layer of PCB. ...Show More
Research on online detection method of HVDC circuit breaker
2022 IEEE Conference on Telecommunications, Optics and Computer Science (TOCS)
Year: 2022 | Conference Paper |
This paper mainly studies a high-voltage DC circuit breaker monitoring and control system, which includes a microprocessor and an alarm system. The inlet of the microprocessor is electrically connected to the output of the monitoring module, and the electrical properties of the inlet of the monitoring module are connected to The input end of the input module, the inlet end of the microprocessor is...Show More
Car electrification is disrupting the high power applications in the automotive market but is also strongly affecting the grid infrastructure because of charging points needs. This paper deals with the analysis of front end converters in high power battery chargers operated with high frequency operations enabled by Silicon Carbide technology.Show More
Design of special end effectors for first aid robot
Taesang Park;Choongpyo Jeong;Jaeseong Lee;Seonghun Lee;Ikho Lee;Hyeonjung Kim;Jinung Ahn;Dongwon Yun
2017 IEEE International Symposium on Safety, Security and Rescue Robotics (SSRR)
Year: 2017 | Conference Paper |
Cited by: Papers (3)
This paper proposes the design of various end effectors for first aid robots. There is a growing demand for special robots that perform rescue operations on behalf of people for rescue in dangerous areas such as disasters or wars. In addition, when injuries occur, first aid treatment is also necessary. In this paper, we design user and system requirements for robots performing first aid and propos...Show More
Design and Control of a Wireless Six Degree Freedom Robotic Arm
Mark John T. Dy;John Brebeuf O. Resurreccion;Brian Christopher D. Santos;Jet Iggy M. Venzon;Edward B. Ang;Vladimir P. Ibañez;Mark Christian E. Manuel;Jocelyn F. Villaverde
In the rapid development of the world, robots have become involved in different aspects of human lives. A robotic arm is a type of machine that is able to manipulate its end effector in two or more axes, thus more mobile than a human arm would be. The most common restraint of a robotic arm is how it needs to be connected to the user through wires, which limits the overall capabilities of the robot...Show More
A Miniaturized LTCC RF front-end Module for SATCOM MSS Handheld Terminals
2022 IEEE Wireless Antenna and Microwave Symposium (WAMS)
Year: 2022 | Conference Paper |
Cited by: Papers (2)
In this paper, an S-band RF front-end (RF-FE) module for satellite communication ground applications is presented. The module integrates a novel embedded low pass filter based on transmission zero technique, embedded power and control lines and is realized using low-temperature co-fired ceramic (LTCC) process in a compact package. By integrating the miniature embedded filter & 3D routing using the...Show More
Analysis of the Field Performances of South-facing Vertical Solar Module in Nis, Serbia
Lana Pantić;Ivana Radonjić;Stefan Dordević;Marko Krstić;Dragan Radivojević;Milutin Petronijević
2024 11th International Conference on Electrical, Electronic and Computing Engineering (IcETRAN)
Year: 2024 | Conference Paper |
This paper presents an analysis of the field performances of south-facing vertical solar module in Nis, Serbia is presented. Electrical parameters, backside temperature and weather parameters were continuously measured and 12 sunny days, predominantly occurring in the middle of each month throughout the year, were selected. The daily change of the solar radiation intensity, maximum power, module t...Show More
With explosive band proliferation as well the use of carrier aggregation (CA), multiple input multiple output (MIMO) techniques and 5G, research in the area of improving the cost, performance and the size of RF transmit solutions is very active with many developments over the past few years. The proliferation of worldwide smartphones has been in part possible due to increase computational power of...Show More
Ultra Linear Dual-band WLAN Front-End Module for 802.11 a/b/g/n Applications with Wide Voltage and Temperature Range Operation
Chun-Wen Paul Huang;Christophe Masse;Chris Zelley;Craig Christmas;Ted Whittaker;Joe Soricelli;William Vaillancourt;Andrew Parolin
2007 IEEE/MTT-S International Microwave Symposium
Year: 2007 | Conference Paper |
Cited by: Papers (1)
A compact 7 times 8 times 1.1 mm3 dual-band Wireless LAN front-end module (FEM) having high linearity and wide temperature (-40 to 85degC) and voltage (2.7 to 4.5 V) operating ranges is presented. The FEM features 28 dB gain and 19.8 dBm at 54 Mbps with EVM < 3% and 230 mA for 2.4 to 2.5 GHz. For 4.9 to 5.9 GHz, the FEM delivers 25 dB gain and 16.5 dBm linear output power at 54 Mbps with EVM < 3% ...Show More
This standard is an extension to IEEE Std 1703(TM). Physical hardware interfaces and signals, such as logical interface and power (digital and mains), that link metrology devices to communications modules via the USB physical layer are specified in this standard. The communication module described in this standard is not integral (not on the same circuit board) with the metrology registers (circui...Show More
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