Study on Interfacial Reactions and Tensile Properties in the Sn/C1990 HP Systems

Diffusion is defined as the phenomenon of materials transported by an atomic motion from two different elements in conjunction that is influenced by the heat treatment [1]. If the components in the system are reactive with each other, both diffusion and reaction would occur to form intermetallic compounds (IMCs) to reach the new equilibrium state [2]. Solder-joint reliability is influenced by the properties of IMC layers which are called interfacial reactions [3, 4]. Thus, interfacial reactions are critical issues for solder-joint reliability. The mechanical characteristic of the solder joint is one of the primary problems in developing electronic packaging, and choosing the right metallization is the important step for obtaining dependable solder connections [5]. The thickness of the IMCs can rise significantly during the operation of an electrical gadget and the ordering modification [6]. The solder material is the most often used material in electronic manufacturing. These materials must offer dependable electrical, mechanical joint connections, and minimal production costs [7].