Research on key technology of the microchannel of a novel LTCC substrate

In this paper, a microchannel embedded in the novel LTCC substrate structure was proposed. Compared with the conventional LTCC substrates, this typical structure that the metal microcolumn array embedded in the new one could increase the area of the heat exchange with the fluid. The metal microcolumn array was interconnected with the cavity and the functionally gradient interface layer. The heat transfer channel was formed, which from chip to metal layer to gradient functional interface layer to embedded microcolumn array layer to liquid cooling flow channel layer. And it eventually achieved the effective heat control. Its heat dissipation coefficient was 125W/cm
²
.The key processes were discussed that could be affecting the quality of the new LTCC substrate microchannel structure, and the specific measures could solve the key technological problems. This work could provide a technical basis for its engineering application.