Design and verification of modular and reusable aging test system for high power SIP

With the rapid development of integrated circuit, 5G, AI and IoT industries, the demand for SIP (System in Package) products is growing rapidly. However, reliability has become the primary challenge for the development of SIP technology. Compared with the traditional package, the SIP circuit has the characteristics of high-power consumption and high internal temperature rise during dynamic operation, so the traditional high temperature test chamber and aging test method cannot meet its test requirements. In this paper, a dynamic aging test scheme based on self-heating is designed for SiP circuit, and an automatic test system without convention high temperature aging test chamber is built. According to the requirements of dynamic aging in GJB548 standard, the results show that the chip surface temperature can be accurately controlled at 85 °C within the range of 0~3°C. The automatic monitoring of aging test status is realized, which ensures the safety of aging test and improves the test efficiency. It also provides an application case for the aging test of the same type of chips.