Systematic Design Considerations for Test Vehicle of TSV Ground Shielding Array

Systematic design considerations for test vehicle (TV) of through silicon via (TSV) ground shielding array are presented in this paper. The design considerations cover the impact of RDL crosstalk, impedance matching, insertion loss, simulation methodology of ground TSV (GTSV) array and measurability. Compared with prior arts which only focus on the shielding performance of the Grounded TSV (GTSV) array, this paper demonstrates that other factors on measurability and practical application need to be carefully considered for the TV design or 2.5D packaging layout with GTSV array.