Preparation and sintering of a new type of micro/nano mixed Cu-Ag particles

In the process, micro/nano mixed Cu-Ag particles were produced by a two-step method, which included the preparation of Cu nanoparticles and Ag doping in micro and nano Cu particles. SEM was provided to observe the morphology of particles and sintered conductive films. The EDS was adopted to identify the element distribution of these particles. The phase was analyzed by X-ray diffraction. In addition, to evaluate the oxidation stability of micro/nano mixed Cu-Ag particles, they were compared with Cu nanoparticles. The thermogravimetric analysis showed that the oxidation stability of micro/nano mixed Cu-Ag particles was stronger than that of Cu nanoparticles. Finally, the conductive ink was prepared by a mixture of synthetic particles and organic solvent and sintered on an alumina ceramic substrate. To obtain the sintering morphology and electrical properties, we compared the micro/nano mixed Cu-Ag particles with Cu nanoparticles after sintering. This study shows that the micro/nano mixed Cu-Ag particles can be applied in the printing electronics field.