Simulation-based Optimization Design of an Iris Recognition Module Packaging

At present, the iris recognition module is mainly realized based on board-level assembly and surface mount technology, which has some problems such as large size and high power consumption. To reduce the packaging volume and power consumption, an iris recognition module based on film-assisted plastic packaging technology is proposed, and the heat dissipation is analyzed and optimized to obtain better thermal performance. Under the conditions of the initial packaging structure and parameters, the junction temperature of the iris recognition module is 69.90 °C, compared with the CIS (CMOS image sensor) packaged by COB (Chip on Board), the volume is reduced by 20.63%, and the junction temperature is reduced by 1.88 °C. After further optimization, the junction temperature decreased by 13.90% and the thermal resistance decreased by 21.64%.