Detachable Terahertz Chip-to-Chip Interconnectors | IEEE Conference Publication | IEEE Xplore

Abstract:

This paper presents the design, simulation, and measurement of a detachable chip-to-chip interconnect operating from 140 to 220 GHz (the WR5.1 band). The design uses a 15...Show More

Abstract:

This paper presents the design, simulation, and measurement of a detachable chip-to-chip interconnect operating from 140 to 220 GHz (the WR5.1 band). The design uses a 15-μm thick silicon substrate and is based on a self-holding interference taper which provides a self-aligned mechanical contact with sufficient force to ensure a low contact resistance. The measured results show good return loss across the WR5.1 band and better than 10 dB from 165 to 220 GHz. The measured insertion loss of the prototype chip (including 28 mm of WR5.1 waveguide and 4 mm of rectangular coax) is better than 2 dB across the band.
Date of Conference: 19-24 June 2022
Date Added to IEEE Xplore: 29 August 2022
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Conference Location: Denver, CO, USA

I. Introduction

The last decade has seen tremendous advances in transistor technology both in CMOS as well as in compound semiconductors (GaAs and InP) [1] [2]. These technologies have been used to implement a wide variety of applications including sensing, communications, and imaging [3] [4]. These advances in integrated-circuit technology have been enabled by significant advances in THz metrology. The development of 4- port vector network analyzers (VNAs) with substantially improved source stability, and the continued advances in GaAs-based Schottky diode multipliers and mixers has enabled the realization of THz frequency extension modules covering the waveguide bands from 100 GHz to over 1 THz. In addition, these advances in VNA frequency range have been accompanied by the development of THz frequency on-wafer probes that allow accurate and rapid measurements of transistors and integrated circuits.

References

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