Effect of OA and JFCE As Surfactants on the Stability of Copper Interconnection CMP Slurry

In the slurry of copper interconnection chemical mechanical polishing (CMP), surfactants are beneficial to achieve a more consistent material removal rate (MRR). They also have a significant effect on the stability of the slurry. In this paper, the effects of cationic surfactant amine oxide (OA) and nonionic surfactant fatty alcohol polyethylene ether (JFCE) on copper MRR and the stability of slurry are discussed. In the FA/OII-based weakly alkaline slurry, the copper MRR tended to increase and then decrease with the increase concentrations of OA or JFCE. However, the slurry containing OA was less stable and the slurry with JFCE could be stable for a longer time.