Formation of Specially Shaped Plating Film by Nickel-Copper Alloy Electrodeposition

In this study, Ni-Cu electrodeposited film with three-dimensional structures was formed by controlling potential using a plating solution which is a mixture of Ni amidosulfate and Cu sulfate. When the concentration ratio of Ni amidosulfate to Cu sulfate was set to 150-450:15 (g/L) and the potential was set to -1.0 to -1.5 V, the electrodeposited film had dendritic morphology.