Temperature-Dependent Characterization and RLGC Model Implementation for a Printed Circuit Board Interconnect

A temperature-dependent modeling approach for interconnects is presented from 23 °C to 139 °C. To develop the proposal, the contribution of the conductor and the dielectric effects to the signal attenuation and delay is quantified from
$S$
-parameters measured to edge-coupled transmission lines configured for differential signaling. Moreover, by obtaining the frequency and temperature-dependent complex permittivity of the dielectric and the characteristic impedance of the lines, a model and parameter extraction strategy for the
RLGC
parameters is proposed. This allows for a representation as a function of temperature and up to 12 GHz, which falls within the operation conditions of practical printed circuit boards based on glass fiber reinforced epoxy laminate materials.