Interaction of advanced copper metallization with the assembly and interconnection technology

A simulative approach is used to compare various copper and Al metallization in active power cycling of a double-sided sintered SiC power module. As damage parameter the crack tip opening method (CTOD) is used. The main damage is occurring in the shearing mode. The parameter study shows that copper has beneficial properties to reduces the ΔCTOD. Assumptions that are made for a high strength copper material shows further reduction of ΔCTOD. As the crack growth behavior for different ΔCTOD is not known and is material dependent, the real benefit cannot be quantified in this study. The thickness of the metallization is varied form 4-30µm and has no significant impact on the damage criterion.