Research on Signal Integrity in High-Speed Interconnection Channel Based on SIwave

In high-speed digital systems, signal transmission frequency reaches microwave or even millimeter waveband. With the increasing frequency, the analog characteristics of digital circuits are becoming obvious, meantime, SI (Signal Integrity) issues are following. In high-speed digital circuits, high-speed connectors are essential and critical components throughout the transmission paths. In transmission process, the critical role for high-speed connectors is to transmit high-speed signals, meanwhile, maintains SI, reducing or even eliminating SI issues such as impedance discontinuous, reflection and crosstalk. Take high-speed backplane connector interconnection channel as an example, 3D models of backplane connectors are built in this paper. Based on full wave 3D electromagnetic simulation software HFSS and dedicated PCB electromagnetics simulation software SIwave, the simulation process of major parameters for signal integrity in high-speed interconnection channels and related optimization method are discussed.