Design of MEMS Model to Analyse Pressure and Hygroscopic Swelling Variables for EMC (Epoxy Mold Compound)

Moisture and pressure desorption characteristics of any epoxy mold compound (EMC) at different conditions, are studied in this paper. As these are the main constraints for the chip to get rid of the mold, here we are considering various values of pressure and moisture to study the deformation caused by different factors. The adhesive strength of the EMC interfaced with different metals is observed. A significant permanent change of the dimension of EMCs due to decohesion and moisture absorption was observed in this paper. These factors (pressure and moisture) are responsible for the durability of the model, when paired with an optimal conductor and when used over time there will be a major improvement in durability. This indicates that not in all the cases the samples can be recovered back to normal, this can cause gaps between the metal and EMC, where it loses contact between these two materials which intern loses the insulation. An optimal metal to attach to the EMC and the optimal height of the EMC is Analysed.