Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs

The rising prominence of heterogeneous integration, coupled with increase in device power, presents unique thermal challenges. Past work has demonstrated the benefits of mono-lithic microfluidic cooling for mitigating these in 2.5D ICs. In this paper, we evaluate the electrical performance benefits of this technology using finite element modeling and experimental demonstration on functional silicon. Ansys models show up to 23.3 × lower thermal coupling between the core chiplets in a CPU with microfluidic cooling compared to traditional air-cooled configurations. Finally, we demonstrate a micropin-fin heatsink etched on the backside of five chiplets in a 2.5D FPGA package and capped with 3D printed manifolds for fluid delivery. A 50.5 % increase in sustained power dissipation for similar die temperatures was achieved with the monolithic heatsink using a 52.5 °C DI water inlet, when compared to the stock cold-plate.