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Resistive and CTAT Temperature Sensors in a Silicon Carbide CMOS Technology | IEEE Conference Publication | IEEE Xplore

Resistive and CTAT Temperature Sensors in a Silicon Carbide CMOS Technology


Abstract:

Accurately sensing the temperature in silicon carbide (power) devices is of great importance to their reliable operation. Here, temperature sensors by resistive and CMOS ...Show More

Abstract:

Accurately sensing the temperature in silicon carbide (power) devices is of great importance to their reliable operation. Here, temperature sensors by resistive and CMOS structures are fabricated and characterized in an open silicon carbide CMOS technology. Over a range of 25-200°C, doped design layers have negative temperature coefficients of resistance, with a maximum change of 79%. Secondly, CMOS devices are used to implement a CTAT, which achieves a maximum sensitivity of 7.5mV/K in a temperature range of 25-165°C. The integration of readout electronics and sensors that are capable of operation in higher temperature than silicon, opens application in harsher environments.
Published in: 2021 IEEE Sensors
Date of Conference: 31 October 2021 - 03 November 2021
Date Added to IEEE Xplore: 17 December 2021
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Conference Location: Sydney, Australia

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Citations are not available for this document.

I. Introduction

The field of wide bandgap semiconductors has gained increased research interest over the past decades. Applications in power electronics [1],[2] are promising and expected to have substantial future markets [3], with silicon carbide (SiC) and gallium nitride (GaN) as the main materials of choice. Due to the large demand of SiC and GaN based power devices, material costs are steadily decreasing. This development is expected to enable other cost-effective future application of these materials, like integrated systems in harsh environment sensing [4]-[9].

Cites in Papers - |

Cites in Papers - IEEE (5)

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1.
Md Asif Khan, Pydi Ganga Bahubalindruni, Alexander May, Chiara Rossi, Mathias Rommel, "Temperature Sensing Readout Circuits with 4H-SiC Technology", 2024 IEEE International Symposium on Smart Electronic Systems (iSES), pp.60-63, 2024.
2.
Alexander May, Mathias Rommel, Leander Baier, Michael Schraml, Jan F. Dick, Michael P. M. Jank, Jörg Schulze, "A 4H-SiC CMOS Technology enabling Smart Sensor Integration and Circuit Operation above 500 °C", 2024 Smart Systems Integration Conference and Exhibition (SSI), pp.1-5, 2024.
3.
Yunfan Niu, Jiarui Mo, Alexander May, Mathias Rommel, Chiara Rossi, Joost Romijn, Guoqi Zhang, Sten Vollebregt, "Design and Characterization of a Data Converter in a SiC CMOS Technology for Harsh Environment Sensing Applications", 2023 IEEE SENSORS, pp.1-4, 2023.
4.
Yaqian Zhang, Jiarui Mo, Sten Vollebregt, Guoqi Zhang, Alexander May, Tobias Erlbacher, "Time-Dependent Dielectric Breakdown of 4H-SiC MOSFETs in CMOS Technology", 2023 24th International Conference on Electronic Packaging Technology (ICEPT), pp.1-4, 2023.
5.
Joost Romijn, Sten Vollebregt, Alexander May, Tobias Erlbacher, Henk W. van Zeijl, Johan Leijtens, Guoqi Zhang, Pasqualina M. Sarro, "Visible Blind Quadrant Sun Position Sensor in a Silicon Carbide Technology", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), pp.535-538, 2022.

Cites in Papers - Other Publishers (2)

1.
Nicola Rinaldi, Rosalba Liguori, Alexander May, Chiara Rossi, Mathias Rommel, Alfredo Rubino, Gian Domenico Licciardo, Luigi Di Benedetto, "A 4H-SiC CMOS Oscillator-Based Temperature Sensor Operating from 298 K up to 573 K", Sensors, vol.23, no.24, pp.9653, 2023.
2.
Joost Romijn, Sten Vollebregt, Luke M. Middelburg, Brahim El Mansouri, Henk W. van Zeijl, Alexander May, Tobias Erlbacher, Johan Leijtens, Guoqi Zhang, Pasqualina M. Sarro, "Integrated 64 pixel UV image sensor and readout in a silicon carbide CMOS technology", Microsystems & Nanoengineering, vol.8, no.1, 2022.
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