Liquid cooling solutions for Automotive HPC: Experimental Thermo-Fluidic Characterisation

Autonomous driving calls for on-board HPC modules requiring enhanced and reliable cooling solutions under harsh environmental conditions. This paper proposes a suitable concept to meet these requirements, including thermal management all along the heat path from silicon to system level, where the heat is rejected into the automotive fluid cooling loop by a pin-fin cooler. We show results of the thermal heat path design and characterization, introduce a performance metric, evaluate the cooler performance limits and potential solutions within a system approach.