Design of Via-Based Miniaturized Microwave Absorber

In this paper, a design of via-based miniaturized microwave absorber (MA) is presented. The absorber is composed of a lossy layer placed above a grounded foam layer. The inclusion of vias in our design enables miniaturization of the cell period as small as 5 mm. In addition, we replace the lumped resistor with a resistive film in the lossy layer to reduce the cost and processing complexity. The simulation results show that the proposed MA in this paper can achieve reflection below -10 dB within 3.75-7.00 GHz.