Antenna-in-Packages for Array Modularization at Millimeter-wave Frequencies and its Applications in 5G O-RAN

In this paper, the design issues of antenna-in-package (AiP) is discussed to modularize arrays at millimeter-wave (mmW) frequencies for 5G applications. The current progress of AiP technologies at NTU is also summarized. The issues of considerations include different fabrication process, dielectric property deviation and mechanical limitations to realize the antenna structure. Antenna designs for various applications, ranging from user equipment, CPE to small cell BTS antennas, have been developed at different sizes. The radiation characteristics of these AiPs will be presented to demonstrate the behaviors of AiPs using these processes. Both full-wave simulations and experimental measurements will be presented to validate the AiP designs.