Study on Current Carrying Capacity of a Novel Interconnect Material ZrTe3

Recently, the discussion about new candidate materials that can replace traditional Cu for future interconnects in integrated circuit (IC) fabrication attracts growing interests. In this paper, we have systematically investigated the breakdown current characteristic of a novel transition metal trichalcogenide (TMTCs)
$\mathbf{ZrTe_{3}}$
by the finite element simulation. First, an electro-thermal coupling model was established, which the Joule heat of the
$\mathbf{ZrTe_{3}}$
nanoribbon acts as the heat source, and both the solid heat transfer and the natural convection heat transfer are considered for the finite element simulation. Then, using the established model and experimental data, the breakdown temperature of the
$\mathbf{ZrTe_{3}}$
nanoribbons in the air environment has been determined. Furthermore, the distribution of both temperature and current density of
$\mathbf{ZrTe_{3}}$
nanoribbons during the breakdown process was investigated for failure analysis. Finally, according to the size-independent resistivity of TMTCs, the breakdown characteristic of the
$\mathbf{ZrTe_{3}}$
with 10nm width was investigated by further finite element simulation. Its breakdown current density can reach 83.8
$\mathbf{MA}/\mathbf{cm}^{2}$
, which demonstrates the high potential of
$\mathbf{ZrTe}_{3}$
nanoribbon as a new type of interconnects material of replacing copper interconnects.