Integrated Resonant Tunneling Diode with Rectangular Waveguide I/O using Photonic Crystal Interface

Hollow-waveguide-packaging technologies for terahertz (THz) electronic devices and integrated circuits are crucial for practical applications. In this study, a new method of packaging an active device using the dielectric waveguide interface is proposed, which offers an easy fabrication and lower insertion loss at THz frequencies, compared with the conventional metallic waveguide approach. We employ a photonic crystal waveguide as a dielectric transmission line, and apply the proposed packaging technique to a resonant tunneling diode (RTD). Using packaged RTD module, we demonstrate 17-Gbit/s error-free wireless communication in the 300-GHz-band.