Conformable Electronics: Thermoforming and Injection Molding of Electronic Components

In this paper the stress on electronic components for Conformable Electronic applications is evaluated. During High-Pressure-Forming (HPF) and subsequent overmolding (OM) these components have to withstand high amounts of stress. Globtops are used to protect 0402 as well as 0603-sized components mounted on different polymer substrates. The components are placed in different areas of deformation (for HPF) and melt velocities (for OM). The components are afterwards examined by means of electrical resistance measurements and shear force measurements as well as micro-sections. For conductive adhesive, the globtop material positively influenced the resistance change after deformation, soldered assemblies showcased good formability up to 20 %. The shear force drop caused by higher deformations could be mitigated using globtop materials. Soldered components were able to withstand OM when globtops were used. Here, smaller components seem to take less damage from the impacting melt. Components should be placed in areas where the melt has cooled down to prevent damages.