Characterization Of Copper Sintered Interconnects By Transient Thermal Analysis

Transient thermal analysis (TTA) is used in this paper for non-destructive testing of copper sintered interconnects, where X-ray reveals no useful data and scanning acoustic microscopy (SAM) data is difficult to evaluate. With TTA instead, comparison between different copper sinter pastes and benchmarking to standard SAC solder pastes is possible and quality variations of interconnects with the same copper sinter paste are detectable. This makes TTA an adequate nondestructive test method for inspection of sintered interconnects.