Reliable joint material by Sn-Cu-Ni IMC fine particles

We have developed Sn-Cu-Ni IMC (intermetallic compound) fine particles for a joint material that forms a robust high heat resistant joint structure with Sn-Cu-Ni IMC in the joint region. In this paper, we report that the internal structure of the developed Sn-Cu-Ni fine particles have solved various problems of the joint material using Sn and Sn-Cu IMC.