Improvement of Nanotwinned Copper Thermal Stability for High Temperature Heterogeneous Integration

The novel nanotwinned copper material was investigated for use as an interconnect material for microelectronic packaging. It provides improved electro-migration and mechanical reliabilities versus traditional Cu interconnects. By adding low level impurities, nt-Cu can be stabilized for a thermal budget of 400
^o
C for 1h annealing. This technology is promising for high temperature heterogeneous integration.